Intel Master Press Feed

Chip Shot: Intel Launches Employee-Curated Digital Magazine

Wed, 16 May 2012 11:39:04 -0400

“iQ by Intel,” launched today as a public beta, is a new publishing platform curated by researchers, engineers and visionaries at Intel. The site, at iQ.intel.com, is inspired by technology trends of how people discover and share content online. iQ is focused on the larger global impact of technology on our world. Specifically, it serves as a discovery tool that narrates technology’s influence and effect on “Media,” “Life” and our “Planet." It’s here to remind us of how fast we’re moving as a global culture, to be cognizant of how far we’ve come as humankind and to reflect on where our planet is headed in the 21st century. The iQ platform was created to spotlight how people are using technology in inspiring ways, and its mission is simple: Share and source content that inspires, educates, entertains and helps all of us to better understand our modern world.

Chip Shot: Intel® SCS Unlocks the Power of Intel® Core™ vPro™ Technology

Tue, 15 May 2012 18:32:16 -0400

Intel today announced its 3rd generation Intel® Core™ vPro™ processor platform that will deliver innovations in performance, security, and automation. As part of that announcement, the company also released the latest version of Intel® Setup and Configuration Software (Intel® SCS). Intel SCS allows organizations to discover, setup and configure, and establish a secure connection to every vPro managed device on its network. Click to learn more about how to use Intel SCS for unlocking the features and the value of systems with Intel Core vPro technology.

Chip Shot: Intel® Core™ vPro™ Strengthens Security, Boosts Performance

Tue, 15 May 2012 13:33:40 -0400

Today Intel announced its 3rd generation Intel® Core™ vPro™ processors based on Intel’s 22nm microarchitecture. Businesses can take advantage of the latest Intel Core vPro processors through a multitude of devices including Ultrabook™ devices, laptops, desktops, workstations and all-in-one PCs. In addition, the 3rd generation Intel Core vPro processors are poised to accelerate the move from isolated, fixed-function systems to intelligent systems in industrial, healthcare and retail sectors.

Chip Shot: Intel's Dr. Genevieve Bell Inducted into WITI Hall of Fame

Tue, 15 May 2012 12:45:08 -0400

Dr. Genevieve Bell, director of user interaction and experience at Intel was named by WITI (Women In Technology International) as one of the the recipients of the 17th Annual WITI Hall of Fame Awards. The Women in Science and Technology Hall of Fame Awards are considered among the most illustrious honors for women in science and technology as noted by Rob Enderle, president and principal analyst of the Enderle Group.

Intel Strengthens Security, Boosts Performance for Business with 3rd Generation Intel® Core™ vPro™ Platforms

Tue, 15 May 2012 08:25:01 -0400

NEWS HIGHLIGHTS

The 3rd generation Intel® Core™ vPro™ processor platform provides businesses and intelligent system designs the security, performance and form factor improvements needed to compute with confidence.
Embedded security features help businesses protect themselves in four ways: threat management, identity and access, data protection, and monitoring and remediation.
Future Ultrabook™ devices built with the 3rd Generation Intel Core vPro processor platform are designed to bridge the gap between IT and business end users.
Enhanced designs help accelerate the move from fixed function and disconnected systems to intelligent systems in retail, industrial and healthcare industries.

SANTA CLARA, Calif., May 15, 2012 - Today's IT managers face a range of challenges from complex business processes to sophisticated security threats. Additionally, a number of industries such as retail, healthcare and industrial are turning to technology to develop innovative solutions to solve the unique challenges facing them in an increasingly connected world. To address these challenges, Intel Corporation has announced the availability of its 3rd Generation Intel® Core™ vPro™ processor-based platforms for business and intelligent systems.

The enhancements to the Intel Core vPro processor platform provide a more secure platform for business computing and drive the next wave of innovation in intelligent systems. The Intel Core vPro processor-based platforms address the realities of today's business climate, where data integrity and organizational efficiency create a competitive advantage. New capabilities embed security at every layer, including the silicon, without compromising performance. Software innovation allows IT managers to set up and configure systems within minutes to quickly implement compelling solutions. Additionally, the enhanced graphics and secure manageability help accelerate the transition and growth in intelligent systems for the retail, industrial, and healthcare industries.

"With the 3rd generation Intel Core vPro processor platform, Intel is leading the way into a new era, delivering the comprehensive and manageable computing solutions to business that enable them to deal with security threats, while providing the flexibility and form factors users demand," said Rick Echevarria, vice president, Intel Architecture Group and general manager, Business Client Platform Division.

Businesses can take advantage of the latest Intel Core vPro processor platform through a multitude of devices including Ultrabook™ devices, laptops, desktops, workstations and all-in-one PCs.

Embedded Security

To defend against identity theft, Intel introduced Intel® Identity Protection Technology with public key infrastructure (Intel® IPT with PKI) into Intel Core vPro processors. The technology provides a new second layer of authentication embedded into the PC that allows websites and business networks to validate that a legitimate user is logging in from a trusted PC by using a private key stored in a PC's firmware. Intel has been working with solution providers and online Web properties such as Feitian, InfoSERVER, Symantec and VASCO to take advantage of Intel IPT technology to ultimately safeguard users' identity.

The latest version of the Intel Core vPro Processor platform also features Intel® OS Guard and Intel® Secure Key. Intel Secure Key, with Intel® AES New Instructions, protects media, data and assets from loss, while Intel OS Guard detects and prevents malware.

Strengthened security from the Intel Core vPro processor platform and McAfee* includes tools such as ePO Deep Command and allow for secure data exchange across increasingly connected ecosystems such as healthcare where doctor's offices share sensitive information with labs and hospitals.

Remote Management and Automation

The Intel Core vPro Processor family includes Intel® Active Management Technology (Intel® AMT) to remotely manage computing issues. Businesses in a range of industries can use Intel AMT to achieve power savings, remote management and inventory control. For example, retailers with point-of-sale machines, digital signs or other intelligent devices can remotely diagnose and quickly fix problems over their network so customer transactions are not interrupted and sales are not lost. With a typical IT service call averaging $200 in a retail environment, large-scale retailers can save millions of dollars in service calls with the ability to remotely manage thousands of systems using Intel AMT.

Industrial computing systems can also use 3rd generation Intel Core processors to consolidate multiple automation functions onto one platform so factories can achieve greater efficiencies in managing all devices and systems. Once all devices and systems are connected, factory managers can collect real-time data for decision making, diagnosis and predictive maintenance.

Intelligent Performance

The 3rd generation Intel Core vPro processors continue to enhance the computing experience in all areas, including the use of business intelligence and big data. The 3rd generation Intel Core vPro processors put greater performance in the hands of more information workers, giving them the ability to access and glean insights from all the information accumulating in their data banks, right on their PC. With the power to handle and manipulate this information faster, familiar PC tools such as Excel are evolving to support this process of creating, collaborating and sharing big data insights.

Additionally, the 3rd generation Intel Core vPro processor family drives significant improvements in compute performance as well as media and graphics capabilities for intelligent systems to meet the needs of compute-intensive applications in retail, industrial and healthcare industries. For example, the support for up to three independent displays makes it possible for a digital sign to drive more displays out of one system versus the previous-generation Intel Core processors. With Intel® Quick Sync Video and Intel® Clear Video HD Technology, medical diagnostic equipment can convert and process digital images and video streams faster, enabling delivery of smoother visuals for healthcare professionals to make timely and accurate diagnoses. The technology also enables end-to-end high definition video conferencing for business users.

The performance improvements also provide the processing power needed to run real-time analytics applications such as Intel® Audience Impression Metrics Suite (Intel® AIM Suite). Intel AIM Suite is an audience detection technology designed for digital signs and retail solutions that need instant metrics gathering to offer more targeted advertising and advanced measurement.

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

Intel, Intel Core vPro, Ultrabook and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: Intel Celebrates 25 Years in Brazil at IDF Sao Paulo

Tue, 15 May 2012 01:12:22 -0400

Celebrating 25 years in Brazil, Intel today held its Intel Developers Forum in Brazil, now the world’s third largest PC market after China and the US. The event included announcements of Banco do Brasil adopting Intel’s Identity Protection Technology for its online banking customers. In addition, Intel announced a public school initiative that will put Classmate Convertible PCs into the hands of over 160,000 Brazilian elementary school students. Intel first launched its Education Program in Brazil over a decade ago, and has since helped 500,000 students across 600 cities there.

Chip Shot: Intel Expands Channel Motherboard Portfolio with Value Oriented Offerings

Mon, 14 May 2012 11:06:17 -0400

Building on its commitment to deliver the industry’s most comprehensive lineup of channel ready motherboards, systems and chassis, Intel today announced an expanded offering for the just released Intel® Xeon® processor E5- 2400 product family. The offering includes four new motherboards spanning a range of entry level customer needs, from SMB to enterprise and the cloud. Read more here.

Intel Gives IT More Options with New Intel® Xeon® Processors

Mon, 14 May 2012 10:57:39 -0400

NEWS HIGHLIGHTS

Three new Intel® Xeon® processor families address todays expanding business requirements, from high performance computing to simple web hosting.
The Intel Xeon processor E5-4600 product family brings efficient performance into a four-socket server configuration for customers seeking additional performance, density and flexibility.
The Intel Xeon processor E5-2400 product family makes the performance and reliability of two-socket servers more affordable for small and medium sized businesses.
Intel Xeon processor E3-1200 v2 product family delivers improved performance per watt, data security for small businesses as well as professional-grade graphics for entry workstation customers

SANTA CLARA, Calif., May 14, 2012 –Intel Corporation today announced the expansion of the Intel® Xeon® processor portfolio with new products designed to address a broad and emerging set of server requirements and provide IT managers with additional choice and flexibility.

To offer a range of energy-efficient and affordable solutions for server and workstation customers, the company introduced twenty-eight processors across three product families: eight processors from the Intel® Xeon® processor E5-4600 product family and nine processors from the Intel® Xeon® processor E5-2400 product family designed to complement the already available Intel® Xeon® processor E5-2600 product family. The company also announced availability of eleven processors from the Intel® Xeon® processor E3-1200 v2 product family.

“Companies today are increasingly dependent upon Information Technology to deliver innovative products and services to customers,” said Boyd Davis, vice president and general manager of the Datacenter Infrastructure Group at Intel. “To satisfy the increasing diversity of IT needs and workloads, Intel is excited to offer additional processor options to enterprises of all sizes with the Intel Xeon processor E5-4600/2400 and E3-1200 v2 product families. Our new products feature the flexibility, value and performance that businesses demand in a market that is ever less tolerant of compromise. We are also continuing to drive momentum in the micro server market by introducing new lower power processors within the Intel Xeon processor E3-1200 v2 product family.”

New Density-Optimized Four-Socket and Cost-Optimized Dual-Socket Processors
The Intel Xeon processor E5-4600 product family offers the performance and energy efficiency benefits of the record-breaking Intel Xeon processor E5 family to allow higher density designs than available with previous 4-socket systems. With up to 32 cores and 48 DIMMs per system, these processors are ideal for a wide range of technical compute applications, such as scientific research and financial services, as well as dense four-socket solutions for communications infrastructure and rapidly growing markets such as China.

These processors support all of the features of the Intel Xeon processor E5 family such as Intel® Advanced Vector Extensions, Intel® Integrated I/O, PCI Express* 3.0, Intel® Turbo Boost Technology 2.0 and Intel® Trusted Execution Technology (Intel® TXT). For traditional 2-socket server customers facing increasing data demands and a need to scale up for additional performance, the new 4-socket servers will open up new opportunities to realize significant total cost of ownership advantages. The Intel Xeon processor E5-4600 product family delivers up to 88 percent higher performance^{1 than a comparable Intel Xeon processor E5-2600 product family-based server and up to 3.8x^{2 the prior generation 2-socket Intel® Xeon® processor 5600 series-based server.}}

Similarly, for small and medium businesses looking to upgrade from a single-socket configuration to a dual-socket server, Intel Xeon processor E5-2400 product family delivers a strong balance of energy-efficient performance and affordability while supporting core features of the Intel Xeon processor E5 family. With up to 3x^{3 the performance and significantly more memory and I/O options, these processors enable higher system densities and easier management compared to a single-socket server solution.}

New Processors for Small Business and High-Density Environments
Also introduced today, the Intel Xeon processor E3-1200 v2 product family is an entry-level server and workstation processor based on Intel’s leading 22-nanometer (nm) process technology. Built for the unique demands of small business customers who require technology that lets them rapidly respond to market conditions and maintain a competitive advantage, these processors deliver up to 32 percent greater energy efficient performance^{4 and PCI Express* 3.0 for higher I/O bandwidth compared to the previous generation. There are more reasons to move up to a server featuring the Intel Xeon processor E3-1200 v2 product family including up to 72 percent improved performance^{5, better security and reliability compared to the latest systems based on the 2nd Generation Intel® Core™ i3-2130 desktop processor. To address workstation customers running professional-grade 2-D and basic 3-D computer-aided drafting as well as entry-level media and entertainment applications, the new processors offer Intel® HD Graphics P4000, which delivers up to 2x faster media processing capabilities^{6 compared to the previous generation.}}}

Intel Continues To Drive Micro Server Momentum
The Intel Xeon processor E3-1200 v2 product family also features two low-power processors optimized for micro servers to address the needs of the emerging scale out datacenter workloads and usages. The Intel Xeon processor E3-1265L v2 based platform delivers up to 39 percent better performance per watt^{7 for simple front end web workloads compared to the previous generation. Intel is also introducing the Intel Xeon processor E3-1220L v2, the world’s lowest power Intel Xeon processor at 17W TDP for dense micro server designs for applications such as low end dedicated hosting and basic content delivery. Systems based on the SSI* Micro Module Server Specification, designed for the micro server segment, and this new Intel Xeon processor, deliver up to 3.6x better performance per rack and up to 1.6x better performance per watt over prior the generation processor using traditional rack servers^8.}

Extensive Industry Support
Starting today, system manufacturers from around the world are expected to announce platforms based on the Intel Xeon processor E5-4600/2400 product families and the Intel Xeon processor E3-1200 v2 product family. These manufacturers include Acer*, Appro*, Asus*, Bull*, Cisco*, Dell*, Fujitsu*, HP*, Hitachi Data Systems*, Hauwei*, IBM*, Inspur*, Lenovo*, NEC*, Quanta*, SGI*, Sugon*, Supermicro*, Tyan* and Unisys*.

Product and Pricing Information
In quantities of 1000, the Intel Xeon processor E5-4600 product family ranges in price from $551 to $3,616, Intel Xeon processor E5-2400 product family ranges from $188 to $1,440 and the Intel Xeon processor E3-1200 v2 product family ranges from $189 to $884. Complete pricing details can be found at http://www.intc.com/priceList.cfm. For more details on these new Intel Xeon processors, visit www.intel.com/xeon. For more details on world records and other claims, visit www.intel.com/performance/server/.

Intel, Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.
For more complete information about performance and benchmark results, visit Performance Test Disclosure

1 Server-side Java* Middleware: Java* middle-tier performance on SPECjbb*2005 benchmark
SPECjbb* is a trademark of the Standard Performance Evaluation Corp. (SPEC). See www.spec.org for more information. Up to 1.88x higher performance based on Intel internal assessment compared to Intel Xeon processor E5-2600 product family using Server-side Java* SPECjbb*2005 benchmark. Source: Intel SSG TR#1228. Baseline 2-socket populated Intel® C606 Chipset-based customer reference server using two Intel® Xeon® processors E5-2680 (8C, 20M Cache, 2.7GHz, 8.0GT/s Intel QPI), 32GB memory (8x 4GB DDR3-1600 DIMMs), Microsoft Windows Server* 2008R2 Enterprise Edition, Oracle HotSpot* 64-bit Server VM build 20,0-v11 using Java* SE RE 1.6.0 Update 25. Score: 1,418,557 bops. New 4-socket populated Intel® C606 Chipset-based customer reference server with four Intel® Xeon® processors E5-4650 (8C, 20M Cache, 2.7GHz, 8.0GT/s Intel QPI), 128GB memory (16x 8GB DDR3-1600 DIMMs), Microsoft Windows Server* 2008R2 Enterprise Edition, Oracle HotSpot* 64-bit Server VM build 20,0-v11 using Java* SE RE 1.6.0 Update 25. Score: 2,663,768 bops.

2 Up to 3.8x greater performance gains based on performance comparisons using best measured 2- and 4-socket server LINPACK MP benchmark results as of 1 March 2012. (Source: TR#1195). Baseline 1.0 – 2-socket server based on Intel Xeon processors X5690 (12M cache, 3.46GHz, 6.4GT/s Intel® QPI), 48GB memory (12x 4GB DDR3-1333). Score: 159.4 GFLOPS. Source: Intel SSG TR#1236.
New 4-socket server based on Intel Xeon processor E5-4650 (20M cache, 2.7GHz, 8.0GT/s Intel QPI), 64GB memory (16x 4GB DDR3-1600). Score: 602 GFLOPS. Source: Intel SSG TR#1264.

3 Up to3X performance based on SPECjbb*2005 Configuration Details:
Intel Xeon processor E3-1280v2 score of 418,575 SPECjbb2005 bops based Intel® C206 chipset based platform with one Intel® Xeon® Processor E3-1280v2 (Quad-core, 3.6GHz, 8MB L3 cache, E0-stepping) , EIST Enabled, Turbo Boost Enabled, Hyper-Threading Enabled, 8GB memory (2x 4GB DDR3-1600 UDIMM), 64G 3Gb/s SATA SSD , Windows 2008 R2 SP1. Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal testing TR1278 as of Mar 2012.
Intel Xeon processors E5-2470 score of 1,305,471 SPECjbb2005 bops based on Intel® C606 chipset-based platform with two Intel® Xeon® Processor E5-2470 (8-core 2.3GHz, 20M L3 cache, 8.0GT/s, 95W, C1-stepping), EIST Enabled, Turbo Boost Enabled, Hyper-Threading Enabled, 48GB memory (3x 8GB DDR3-1600 RDIMM), 64GB SATA SSD, Windows 2008 R2 Enterprise. Java SE Runtime Environment (build 1.6.0_27-b07), Java HotSpot 64-Bit Server VM (build 20.2-b06, mixed mode). Source: Intel internal testing TR1230 as of Dec 2011.

4 Up to 32% better energy efficient performance based on gen to gen comparison using SPECpower_ssj*2008. Details: SPECpower_ssj2008
Baseline Configuration and Score on Benchmark: Intel® C206 chipset CRB platform with one Intel® Xeon ® Processor E3-1280(Quad-Core, 3.5GHz, 8MB L3 cache), Turbo Boost Disabled, Hyper-Threading Enabled, 8GB memory (2x 4GB DDR3-1333 UDIMM), 64GB SATA SSD, Windows Server2008R2 SP1. Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal testing as of Mar 2012. Score: 2957.
New Configuration and Score on Benchmark: Intel® C206 chipset CRB platform with one Intel® Xeon® Processor E3-1280v2 (Quad-core, 3.6GHz, 8MB L3 cache, E0-stepping) , EIST Enabled, Turbo Boost Disabled, Hyper-Threading Enabled, 8GB memory (2x 4GB DDR3-1600 UDIMM), 64G 3Gb/s SATA SSD , Windows 2008 R2 SP1. Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal testing as of Mar 2012. Score: 3895.

5 Up to 72% better performance based on SPECint*_rate_base2006 comparison between Intel® Xeon® E3-1220V2 and Intel® Core™ processor i3-2130. Details: Baseline Configuration and Score on Benchmark: Intel® Core™ processor i3-2130, best published SPECint*_rate_base2006 score of 87.8 as of April 19, 2012.
http://www.spec.org./cpu2006/results/res2011q4/cpu2006-20111205-19118.html
New Configuration and Score on Benchmark: Intel® C206 chipset-based Platform with one Intel® Xeon® Processor Intel® Xeon® Processor E3-1220V2 (8M Cache, 3.10 GHz, E0 stepping), EIST Enabled, Turbo Boost enabled, Hyper-Threading Not supported, 16GB memory (2x 8GB DDR3-1600 ECC UDIMM), 160GB SATA 7200RPM HDD, Red Hat* Enterprise Linux Server 6.2 with kernel: 2.6.32-220.el6.x86_64. Compiler version: 12.1.0.225 of Intel C++ Studio XE and Intel Fortran. Source: Intel internal testing estimates as of Feb 2012. Score: SPECint_rate_base2006=151

6 Up to 2x faster media processing capabilities based on gen to gen comparison using 3DMarkVantage 1.2.0. Baseline Configuration and Score on Benchmark: Intel® Xeon® processor E3-1245 (4C/4T, 8MB Cache, 3.30 GHz), Intel® HD Graphics P3000, Motherboard: Intel® DZ68DB, BIOS DBZ6810H.86A.0032.2011.0928.1502, Memory Micron* 8 GB (2x4 GB) DDR3 1333. 3DMarkVantage 1.2.0 - 3DMark Score (Performance Preset @1280x1024) - 1773
New Configuration and Score on Benchmark: Intel® Xeon® processor E3-1245v2 (4C/4T, 8MB Cache, 3.40GHz), Intel® HD Graphics P4000, Motherboard: Intel® DZ77GA-70K, BIOS GAZ7710H.86A.1868.R06.1201060946, Memory Samsung* 8 GB (2x4 GB) DDR3 -1600. 3DMarkVantage 1.2.0 - 3DMark Score (Performance Preset @1280x1024) - 4085

7 Up to 39% better energy efficient performance based on gen to gen comparison using SPECpower_ssj*2008. Details:
Baseline Configuration and Score on Benchmark: Intel® C206 chipset based platform with one Intel® Xeon ® Processor E3-1260L (Quad-Core, 2.4GHz, 8MB L3 cache), EIST Enabled, Turbo Boost Enabled, Hyper-Threading Enabled, 8GB memory (2x 4GB DDR3-1333 UDIMM), 64GB SATA SSD, Windows Server2008R2 SP1. Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal testing as of Mar 2012. Score: 3079.
New Configuration and Score on Benchmark: Intel® C206 chipset based platform with one Intel® Xeon® Processor E3-1265Lv2 (Quad-core, 2.5GHz, 8MB L3 cache, E0-stepping) , EIST Enabled, Turbo Boost Enabled, Hyper-Threading Enabled, 8GB memory (2x 4GB DDR3-1600 UDIMM), 64G 3Gb/s SATA SSD , Windows 2008 R2 SP1. Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal testing as of Mar 2012. Score: 4291.

8 Baseline configuration: Intel® Xeon® processor E3-1220L
Maximum number of nodes, 42U rack: 41 1U server + 1x 1U 48 port GbE Ethernet switch
Performance per node/rack: Best published SPECint*_rate_base2006 score of 69 as of April 26, 2012.
http://www.spec.org/cpu2006/results/res2012q1/cpu2006-20111219-19191.html. 41 servers = 2829
Power per node: Max power consumption of one Intel® Xeon® Processor E3-1220L on a Intel® C206 chipset-based platform using SPECpower_ssj2008, EIST Enabled, Turbo Boost Enabled, 8GB memory (2x 4GB DDR3-1333 UDIMM), 64G 3Gb/s SATA SSD , Windows 2008 R2 SP1. Java SE Runtime Environment (build 1.6.0_30-b12), Java HotSpot 64-Bit Server VM (build 20.5-b03, mixed mode). Source: Intel internal testing as of Mar 2012. Score: (ssj_ops@100%: 147,345, Power@100%: 50.1W, Active idle power: 25.4)
Power per rack: 2.3kW total. 1U switch = 240W, 41 1U server nodes = 2054W

Micro server Configuration: Intel® Xeon® Processor E3-1220Lv2
Maximum number of nodes: SSI rack= 10 3U chassis with 119 nodes + 3x 1U 48 port GbE switches
Performance per node/rack: Intel® C206 chipset-based platform with one Intel® Xeon® Processor E3-1220LV2 (3M Cache, 2.30 GHz, L1 stepping), EIST Enabled, Turbo Boost enabled, Hyper-Threading Enabled, 16GB memory (2x 8GB DDR3-1600 ECC UDIMM), 160GB SATA 7200RPM HDD, Red Hat* Enterprise Linux Server 6.2 with kernel: 2.6.32-220.el6.x86_64. Compiler version: 12.1.0.225 of Intel C++ Studio XE and Intel Fortran. Source: Intel internal testing estimates as of Feb 2012. Score : SPECint_rate_base2006 of 85.7, 119 nodes = 10198.3
Power per node: Based on Intel estimates of 36W per node with one Intel® Xeon® Processor E3-1220Lv2 node, EIST Enabled, Turbo Boost Enabled, 8GB memory (2x 4GB DDR3-1600 UDIMM), 1x SSD, assuming shared cooling resources and shared power supplies
Power per rack: 5.0kW total. 3x 1U switches at 240W per switch = 720W, 119 nodes at 36W estimated per node = 4284W

Chip Shot: Intel Expands Xeon Processors Portfolio with Three New Product Families

Mon, 14 May 2012 10:05:38 -0400

To offer a range of energy-efficient and affordable solutions for server and workstation customers, Intel introduced twenty-eight processors across three product families: Intel Xeon processors E5-4600 product family designed to bring efficient performance into a four-socket server configuration for customers seeking additional performance, density and flexibility; Intel Xeon processors E5-2400 product family to make the performance and reliability of two-socket servers more affordable for small and medium sized businesses; Intel Xeon processors E3-1200 v2 product family, first server processors based on 22nm Tri-Gate transistors, to deliver improved performance per watt, data security for small businesses or high-density environments and professional-grade graphics for entry workstation customers.

Intel Survey Finds 'Digital Over-Sharing' is Leading Mobile Etiquette Faux Pas

Tue, 08 May 2012 19:38:03 -0400

NEWS HIGHLIGHTS

Majority of U.S. adults say others divulge too much information about themselves online.
One-third of U.S. adults are more comfortable sharing information online than in person.
One in five U.S. adults admits to sharing false information online.

SANTA CLARA, Calif., May 9, 2012 – According to a recent survey sponsored by Intel Corporation and conducted by Ipsos Observer* on "Mobile Etiquette" and "Digital Sharing," 9 out of 10 American adults believe that people are sharing too much information about themselves online, with nearly half of U.S. adults reporting that they feel overwhelmed by the amount of information shared.

Intel's 2012 "Mobile Etiquette" survey evaluated the current state of mobile manners (compared to previous surveys commissioned by Intel in 2009 and 2011). The survey also examined how U.S. adults share and consume information online and how certain digital sharing behaviors impact culture and relationships.

A 2012 report from the Pew Research Center1 reports that 77 percent of U.S. adults own a laptop or desktop computer, 44 percent own a smartphone and 18 percent own a tablet, with 1 in 10 U.S. adults owning all 3 mobile devices. In addition to owning mobile devices, U.S. adults are spending an increasingly significant amount of time online. Nielsen2 recently reported that 117.6 million people visited the Internet via a mobile device last year. As the availability of mobile devices (smartphones, tablets, netbooks, laptops, Ultrabook systems) increases, a continued awareness of how people use their devices is also on the rise.

One-third of U.S. adults (33 percent) responding to the Intel "Mobile Etiquette" survey said they are more comfortable sharing information online than in person. If it wasn't for the ability to share and consume information online via mobile devices, nearly half of U.S. adults (46 percent) feel they would not know what is happening with their family and friends.

"What it means to be 'digital' is something we are all having to negotiate," said Intel Fellow Dr. Genevieve Bell, director of user interaction and experience at Intel Labs. "As new technologies, devices and services appear, everyone will continue to sort out how all of this will fit into our lives – and how we use these devices and services to connect with others. It has become so much easier to share the small details of our lives with our friends and family, but I think some people are still figuring out the right balance between staying connected and 'over-sharing.'"

"The work we do at Intel, from product development to consumer research, helps us enable the experiences that people will love," Bell continued. "As technology continues to evolve, the ability to create, share and consume information is becoming more and more abundant. The latest Intel 'Mobile Etiquette' survey highlights the fact that people are still grappling with how to balance the benefits of mobile technology with the downsides – this means we all still have those moments of poor mobile manners."

Intel enables the mobile lifestyles that are possible today with products powered by the visibly smart Intel® Core™ processors and the Intel® Atom™ processor family, as well as cloud-based services that allow consumers to create, share and consume content and enjoy amazing digital experiences anytime, anywhere. As an innovator behind the technology powering mobile devices and mobile lifestyles, Intel is on a continued quest to understand consumers' changing mobile usage models, how it impacts consumers' lives, and how technology should evolve in the future. This drives Intel innovation to create the technology experiences that people desire and love.

Key Survey Findings

According to Intel's recent "Mobile Etiquette" survey, an overwhelming majority of U.S. adults (85 percent) share information online, with one-quarter of U.S. adults sharing information at least once a day. Nearly one-quarter of U.S. adults (23 percent) feel they are missing out when they are not able to share or consume information online.

The Intel survey revealed that while digital sharing on mobile devices (smartphones, tablets, netbooks, laptops, and Ultrabook systems) helps us stay connected to others, the tendency to perhaps share too much information can annoy some people. U.S. adults reported the following digital sharing behaviors as top pet peeves: people who constantly complain (59 percent), people who post inappropriate/explicit photos (55 percent), and people who share information that they would consider private (53 percent).

Intel survey respondents stated that they wish people thought more about how others perceive them when reading shared information online, and how this can cause people to form opinions based on a person's online personality and sharing behavior. Four out of 10 U.S. adults reported that they typically choose not to associate with people whose opinions they disagree with online.

More than one-quarter of respondents (27 percent) stated that they are an open book —both in person and online — and that there is very little they would not share online. However, only about half of U.S. adults (51 percent) said that they would feel comfortable if all of their online activity was made public. Perhaps this is because 27 percent of U.S. adults admit to having a different personality online than in person, and 1 in 5 U.S. adults (19 percent) reported that they have shared false information online.

Most U.S. adults (81 percent) believe that mobile manners are becoming worse (compared to 75 percent of U.S. adults surveyed a year ago), and 92 percent of U.S. adults wish people practiced better mobile etiquette in public. As a follow up to Intel's "Mobile Etiquette" surveys in 2009 and 2011, U.S. adults continue to report that the top 3 pet peeves are texting or typing while driving a car (77 percent), talking on a device loudly in a public place (64 percent), and having the volume too loud in a public place (55 percent).

The Emily Post Institute's Take on Manners for a New World

With technology advancements by Intel and other companies making it easier than ever to share content from anywhere and at any time, the recent Intel survey revealed that the majority of U.S. adults (86 percent) agree that social etiquette needs to be updated to include guidelines on "Mobile Etiquette" and "Digital Sharing."

"The Intel survey results clearly show that we love being connected. Sharing and getting together online are integral parts of building and maintaining relationships," explains author and etiquette expert Anna Post of The Emily Post Institute. "But we're still finding our way when it comes to determining the most appropriate behavior in any given situation online. Should I post

a picture of my friend's newborn before she does? Is it acceptable to have 3 different online dating profiles? Does your entire social network want to know what you had for dinner last night? The Intel survey results help us to continue building etiquette guidelines for appropriate online behavior and sharing."

Live Audio Conference Call

Join Bell at 9 a.m. PDT today (May 9) for a live audio conference call that will further explore the findings of Intel's latest "Mobile Etiquette" survey. Bell will share her insights on the findings, as compared to her own work as an anthropologist and researcher. The conference call will conclude with a brief Q&A.

In Bell's role with Intel as the director of user interaction and experience in Intel Labs, she leads a research team of social scientists, interaction designers, human factors engineers and computer scientists. This team shapes and helps create new Intel technology and products that are increasingly designed around people's needs and desires. In addition to leading this increasingly important area of research at Intel, Bell is an accomplished industry pundit on the intersection of culture and technology.

To attend, please register at: http://bit.ly/IntelMobileEtiquetteCall. Once you have registered, you will be provided with the information you need to join the conference, including dial-in numbers and passcodes.

Survey Methodology

The survey was conducted online within the United States by Ipsos Observer on behalf of Intel from March 1-16, 2012 among a nationally representative sample of 2,008 U.S. adults ages 18 and older with a margin of error of plus or minus 2.2 percentage points.

For additional information on Intel's "Mobile Etiquette" survey, visit www.intel.com/newsroom/mobileetiquette.

Fact Sheet

Fact Sheet: 2012 State of Mobile Etiquette and Digital Sharing: Intel Survey (PDF 182KB)

According to Intel's 2012 "Mobile Etiquette" survey, an overwhelming majority of U.S. adults (85 percent) share information online, with one-quarter of U.S. adults sharing information at least once a day.

According to Intel's 2012 "Mobile Etiquette" survey, 9 out of 10 U.S. adults believe that people share too much information about themselves online.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

1 Amy Mitchell, Tom Rosenstiel and Leah Christian; "Mobile Devices and News Consumption: Some Good Signs for Journalism"; http://stateofthemedia.org/2012/mobile-devices-and-news-consumption-some-good-signs-for-journalism/

2 "State of the Media: U.S. Digital Consumer Report Q3 – Q4 2011"; www.nielsen.com/content/dam/corporate/us/en/reports-downloads/2012-Reports/Digital-Consumer-Report-Q4-2012.pdf

Chip Shot: New 22nm Intel® Xeon® Processors to Boost Dell Micro Servers' Performance by 95%

Tue, 08 May 2012 11:00:50 -0400

Today Dell announced its latest Dell PowerEdge C5220 - the world’s first microserver to be based on the Intel® Xeon® processor E3-1200 v2 product family featuring the industry leading 22nm technology with 3D Tri-Gate transistors. The upcoming Intel Xeon family of single socket server processors will include lowest voltage Intel Xeon ever - 17 Watt as well as 45 Watt TDPs. Dell's micro servers with new processors are designed to deliver up to 95% more performance within the same rack and 50% more density compared to the previous generation of micro servers.

Chip Shot: Live Chat with Intel's Genevieve Bell on Mobile Etiquette this Wed.

Tue, 08 May 2012 10:00:02 -0400

Nine out of 10 U.S. adults believe people are sharing too much information about themselves online according to Intel's 2012 "Mobile Etiquette" survey. Please join us Wed., May 9 at 9 a.m. PDT to hear Intel Fellow Genevieve Bell, director of user interaction and experience at Intel Labs, share her insights on the latest findings from Intel’s annual “Mobile Etiquette” survey and how the results compare to previous surveys commissioned by Intel in 2009 and 2011. A live Q&A session will follow. Register online now to receive conference call-in details.

Chip Shot: Intel HD Graphics Windows* 8 Driver Now Available for Download

Mon, 07 May 2012 09:00:15 -0400

Intel beta graphics drivers for the Microsoft Windows 8 Consumer Preview are now available to support 3rd generation Intel® Core™ processors with HD Graphics 4000/2500 and 2^{nd generation Intel Core processors with Intel HD Graphics 3000/2000. The 32-bit and 64-bit drivers provide support for Windows Display Driver Model version 1.2 (WDDM v1.2) features including flicker free rotation, native stereoscopic 3D and Microsoft DirectX* 11 video. Intel will provide regular driver updates for Windows 8 and encourages users to provide feedback and suggestions for future releases.}

Intel Announces Increase in Quarterly Cash Dividend

Mon, 07 May 2012 08:00:03 -0400

Dividend Increased to 90 cents Per Share on an Annual Basis

SANTA CLARA, Calif., May 7, 2012 – Intel Corporation today announced that its board of directors has approved a 7 percent increase in the quarterly cash dividend to 22.5 cents per share (90 cents per share on an annual basis), beginning with the dividend that will be declared in the third quarter of 2012.

Today's announcement is the third dividend increase in the past 18 months. Intel's dividend has increased every year over the past decade and was recently recognized as Dividend Channel’s ‘Top Dividend Stock of the Nasdaq 100.”

"2012 is expected to be another year of record revenues for Intel, with strong demand in our core business and significant progress in smartphones and other new growth areas,” said Paul Otellini, Intel president and CEO. “This latest dividend increase is one more example of our commitment to return cash to our stockholders as we continue to generate strong cash flow fueled by the global growth of computing.”

Taken together since their inception, Intel's dividends and stock buyback program have returned approximately $112 billion to stockholders.

Risk Factors

The above statements and any others in this document that refer to plans and expectations for the second, third and fourth quarters, the year and the future are forward-looking statements that involve a number of risks and uncertainties. Words such as "anticipates," "expects," "intends," "plans," "believes," "seeks," "estimates," "may," "will," "should" and their variations identify forward-looking statements. Statements that refer to or are based on projections, uncertain events or assumptions also identify forward-looking statements. Many factors could affect Intel's actual results, and variances from Intel's current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following to be the important factors that could cause actual results to differ materially from the company's expectations.
Dividend declarations and the dividend rate are at the discretion of Intel's board of directors, and plans for future dividends may be revised by the board. Intel's dividend program could be affected by changes in Intel's operating results, its capital spending programs, changes in its cash flows and changes in the tax laws, as well as by the level and timing of acquisition and investment activity.
Demand could be different from Intel's expectations due to factors including changes in business and economic conditions, including supply constraints and other disruptions affecting customers; customer acceptance of Intel’s and competitors’ products; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers. Uncertainty in global economic and financial conditions poses a risk that consumers and businesses may defer purchases in response to negative financial events, which could negatively affect product demand and other related matters.
Intel operates in intensely competitive industries that are characterized by a high percentage of costs that are fixed or difficult to reduce in the short term and product demand that is highly variable and difficult to forecast. Revenue and the gross margin percentage are affected by the timing of Intel product introductions and the demand for and market acceptance of Intel's products; actions taken by Intel's competitors, including product offerings and introductions, marketing programs and pricing pressures and Intel’s response to such actions; and Intel’s ability to respond quickly to technological developments and to incorporate new features into its products.
Intel is in the process of transitioning to its next generation of products on 22nm process technology, and there could be execution and timing issues associated with these changes, including products defects and errata and lower than anticipated manufacturing yields.
The gross margin percentage could vary significantly from expectations based on capacity utilization; variations in inventory valuation, including variations related to the timing of qualifying products for sale; changes in revenue levels; segment product mix; the timing and execution of the manufacturing ramp and associated costs; start-up costs; excess or obsolete inventory; changes in unit costs; defects or disruptions in the supply of materials or resources; product manufacturing quality/yields; and impairments of long-lived assets, including manufacturing, assembly/test and intangible assets.
The tax rate expectation is based on current tax law and current expected income. The tax rate may be affected by the jurisdictions in which profits are determined to be earned and taxed; changes in the estimates of credits, benefits and deductions; the resolution of issues arising from tax audits with various tax authorities, including payment of interest and penalties; and the ability to realize deferred tax assets.
Gains or losses from equity securities and interest and other could vary from expectations depending on gains or losses on the sale, exchange, change in the fair value or impairments of debt and equity investments; interest rates; cash balances; and changes in fair value of derivative instruments.
The majority of Intel’s non-marketable equity investment portfolio balance is concentrated in companies in the flash memory market segment, and declines in this market segment or changes in management’s plans with respect to Intel’s investments in this market segment could result in significant impairment charges, impacting restructuring charges as well as gains/losses on equity investments and interest and other.
Intel's results could be affected by adverse economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates.
Expenses, particularly certain marketing and compensation expenses, as well as restructuring and asset impairment charges, vary depending on the level of demand for Intel's products and the level of revenue and profits.
Intel’s results could be affected by the timing of closing of acquisitions and divestitures.
Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust, disclosure and other issues, such as the litigation and regulatory matters described in Intel's SEC reports. An unfavorable ruling could include monetary damages or an injunction prohibiting Intel from manufacturing or selling one or more products, precluding particular business practices, impacting Intel’s ability to design its products, or requiring other remedies such as compulsory licensing of intellectual property.

A detailed discussion of these and other factors that could affect Intel’s results is included in Intel’s SEC filings, including the company’s latest earnings release, Form 10-Q and Form 10-K.

Intel has not reviewed, does not endorse or adopt, and expresses no views on the accuracy of the information reported by the Dividend Channel

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Intel Announces Increase in Quarterly Cash Dividend

Mon, 07 May 2012 00:25:47 -0400

Dividend Increased to 90 cents Per Share on an Annual Basis

Taken together since their inception, Intel's dividends and stock buyback program have returned approximately $112 billion to stockholders.

Risk Factors

The above statements and any others in this document that refer to plans and expectations for the second, third and fourth quarters, the year and the future are forward-looking statements that involve a number of risks and uncertainties. Words such as "anticipates," "expects," "intends," "plans," "believes," "seeks," "estimates," "may," "will," "should" and their variations identify forward-looking statements. Statements that refer to or are based on projections, uncertain events or assumptions also identify forward-looking statements. Many factors could affect Intel's actual results, and variances from Intel's current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following to be the important factors that could cause actual results to differ materially from the company's expectations.
Dividend declarations and the dividend rate are at the discretion of Intel's board of directors, and plans for future dividends may be revised by the board. Intel's dividend program could be affected by changes in Intel's operating results, its capital spending programs, changes in its cash flows and changes in the tax laws, as well as by the level and timing of acquisition and investment activity.
Demand could be different from Intel's expectations due to factors including changes in business and economic conditions, including supply constraints and other disruptions affecting customers; customer acceptance of Intel’s and competitors’ products; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers. Uncertainty in global economic and financial conditions poses a risk that consumers and businesses may defer purchases in response to negative financial events, which could negatively affect product demand and other related matters.
Intel operates in intensely competitive industries that are characterized by a high percentage of costs that are fixed or difficult to reduce in the short term and product demand that is highly variable and difficult to forecast. Revenue and the gross margin percentage are affected by the timing of Intel product introductions and the demand for and market acceptance of Intel's products; actions taken by Intel's competitors, including product offerings and introductions, marketing programs and pricing pressures and Intel’s response to such actions; and Intel’s ability to respond quickly to technological developments and to incorporate new features into its products.
Intel is in the process of transitioning to its next generation of products on 22nm process technology, and there could be execution and timing issues associated with these changes, including products defects and errata and lower than anticipated manufacturing yields.
The gross margin percentage could vary significantly from expectations based on capacity utilization; variations in inventory valuation, including variations related to the timing of qualifying products for sale; changes in revenue levels; segment product mix; the timing and execution of the manufacturing ramp and associated costs; start-up costs; excess or obsolete inventory; changes in unit costs; defects or disruptions in the supply of materials or resources; product manufacturing quality/yields; and impairments of long-lived assets, including manufacturing, assembly/test and intangible assets.
The tax rate expectation is based on current tax law and current expected income. The tax rate may be affected by the jurisdictions in which profits are determined to be earned and taxed; changes in the estimates of credits, benefits and deductions; the resolution of issues arising from tax audits with various tax authorities, including payment of interest and penalties; and the ability to realize deferred tax assets.
Gains or losses from equity securities and interest and other could vary from expectations depending on gains or losses on the sale, exchange, change in the fair value or impairments of debt and equity investments; interest rates; cash balances; and changes in fair value of derivative instruments.
The majority of Intel’s non-marketable equity investment portfolio balance is concentrated in companies in the flash memory market segment, and declines in this market segment or changes in management’s plans with respect to Intel’s investments in this market segment could result in significant impairment charges, impacting restructuring charges as well as gains/losses on equity investments and interest and other.
Intel's results could be affected by adverse economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates.
Expenses, particularly certain marketing and compensation expenses, as well as restructuring and asset impairment charges, vary depending on the level of demand for Intel's products and the level of revenue and profits.
Intel’s results could be affected by the timing of closing of acquisitions and divestitures.
Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust, disclosure and other issues, such as the litigation and regulatory matters described in Intel's SEC reports. An unfavorable ruling could include monetary damages or an injunction prohibiting Intel from manufacturing or selling one or more products, precluding particular business practices, impacting Intel’s ability to design its products, or requiring other remedies such as compulsory licensing of intellectual property.

A detailed discussion of these and other factors that could affect Intel’s results is included in Intel’s SEC filings, including the company’s latest earnings release, Form 10-Q and Form 10-K.

Intel has not reviewed, does not endorse or adopt, and expresses no views on the accuracy of the information reported by the Dividend Channel

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: Intel Shows Off New Switch Platform at Interop

Fri, 04 May 2012 13:33:39 -0400

Intel next week will tap the Interop trade show in Las Vegas for a sneak preview of a powerful new data center switch reference platform, expected to be released this fall. The Seacliff Trail reference platform will combine Intel® Ethernet Switch FM6000 technology (which Intel attained via the Fulcrum Microsystems acquisition) with the Intel® 82599 10 Gigabit Ethernet Controller and a Crystal Forest-based packet processing and control plane subsystem. Get more information.

Chip Shot: Intel and McAfee Outline Technologies to Make Cloud More Secure

Fri, 04 May 2012 11:45:39 -0400

Although cloud computing adoption is on the rise among enterprises, security still remains a major concern among IT desicion makers. To address this challenge, Intel and McAfee provided insight into the security issues facing IT, and discussed how they are helping businesses build new lines of defense through joint innovation and currently available solutions. Based on the findings of a recent Intel-sponsered survey among IT professionals, both companies also outlined the areas that will have to be addressed in the future to make cloud computing safer and more secure. Jason Waxman, Intel GM of Cloud Infrastructure Group shares his thoughts in this blog on how Intel's and McAfee's joint efforts may accelerate Cloud adoption. More details about Intel's and McAfee's current technolgies and future plans can be also found here.

Chip Shot: Kick Off Cinco de Mayo with Intel AppUp℠ center

Fri, 04 May 2012 11:26:47 -0400

This year, celebrate Cinco de Mayo by learning or brushing up on Spanish with Superstar Spanish, an educational program that uses games and issues awards for progress. Or, if you’re interested in traditional help, download Tutor.com, a free online tutoring service that provides one-on-one assistance. To enhance your Spanish vocabulary, use the Intel AppUp℠ center’s English-Spanish Words Card Game, which lets you find word pairs right on your computer. Once you’ve mastered the language, award yourself with a special Mexican dish using recipes found on CookIt 123.

Chip Shot: New Kia K9 Luxury Sedan Features Intel-powered IVI System

Thu, 03 May 2012 11:52:20 -0400

Intel Corporation announced today that the Intel® Atom™ processor powers the in-vehicle infotainment (IVI) system in Kia Motors Corporation’s new K9 luxury sedan available in Korea. The IVI system features dual, independent displays. The dashboard display allows the driver to take advantage of state-of-the-art functions and services like voice recognition, smartphone remote start, stolen vehicle location tracking, and Internet access. The rear seat display features 3-D graphic performance and supports various video formats, as well as Bluetooth functionality. For more information, view the press release.

Chip Shot: New Intel® Media SDK Supports Blu-ray 3D, Open CL on 3rd Gen Intel® Core™ Processors

Wed, 02 May 2012 17:39:02 -0400

Intel released Intel® Media SDK 2012 R2, now supporting Blu-ray MVC, stereoscopic (two-view) video. The new SDK also includes an Open CL sample, allowing developers to make the most of resources available on Intel platforms by supporting the newly released Intel® SDK for OpenCL Applications 2012 on both Intel processors and Intel® HD Graphics. Providing developers with a simple API to create media applications using Intel® Quick Sync Video, the SDK can enable hardware acceleration to significantly speed up media conversion on 3rd generation Intel® Core™ processors. Developers can download a free copy of Intel® Media SDK 2012 R2.

Chip Shot: Boost Your Productivity with Intel AppUp℠ center

Mon, 30 Apr 2012 16:43:01 -0400

In celebration of Administrative Professionals’ Day, check out the following apps from the Intel AppUp^{SM center} to boost your productivity and creativity. With LibreOffice, an open source productivity suite, develop spreadsheets, presentations and word documents. Create post-it note reminders on your desktop with Sticky Notes. Working at a busy location? Enhance the privacy of your computer screen with LookAtMeWork, which lets you quickly hide your current window in a flash. After a hard day’s work, transform into a DJ with Zya Music by dropping massive beats and putting your personal spin on the world’s most famous songs.

Chip Shot: Intel Tops Green and Sustainable Rankings

Thu, 26 Apr 2012 18:40:31 -0400

For the fourth consecutive year, Intel is ranked first on the EPA’s “Top 50 Green Power Partnership” Rankings. EPA rankings honor organizations voluntarily using clean, renewable electricity from natural resources. Additionally, Intel ranked among the top five companies honored in this week’s updated Maplecroft Climate Innovation Indexes, which measure companies’ adaptations to climate change. Learn more about Intel’s sustainability initiatives.

Chip Shot: Intel Capital Invests in YCombinator Personal Search Company

Wed, 25 Apr 2012 14:52:04 -0400

Looking for an easier way to find people? Check out Ark, a new personal search company that has indexed more than 1 billion profiles across the top social networks around the world. A member of YCombinator’s recent Winter 2012 class, Intel Capital today announced an investment in Ark as part of the largest seed round ever raised by a YCombinator company. Ark will use this investment to expand their current mobile and search engineering teams and build out their personal search products. The site is currently in private beta with over 15,000 users, and has received over a quarter of a million requests for invites. To request your invite visit ark.com, and learn more about today's news.

Chip Shot: C++ Software Developers Get a Multicore Power-Up

Wed, 25 Apr 2012 14:26:02 -0400

Intel released a new version of Intel® Concurrent Collections for C++, a library which helps developers write and tune parallel software. Version 0.7 enables developers to deploy applications seamlessly on either a single Intel multicore workstation or a cluster of workstations, providing developers a way for the developer to easily control the execution of their application, offering greater potential for parallelism, scalability and productivity. Intel Concurrent Collections for C++ is available for Windows and Linux as a free download through the Intel Software Network.

Chip Shot: Jobs at Intel Mobile App Launched

Wed, 25 Apr 2012 12:31:05 -0400

Finding the right job at Intel is at your fingertips on your Android device and Apple iPhone thanks to the “Jobs at Intel” mobile app now available on Google Play and iTunes. The app provides an up-to-date listing of Intel’s job openings, job alerts, connections to Intel’s social media recruiting channels, and the ability to e-mail job postings so you can complete the application process or send to a friend. What are you waiting for? Download it now!

Intel Acquires Industry-Leading, High-Performance Computing Interconnect Technology and Expertise

Tue, 24 Apr 2012 16:28:02 -0400

Key Assets from Cray Accelerate Intel’s Drive to Achieve ExaFLOPS Performance

SANTA CLARA, Calif., April 24, 2012 – Intel Corporation today announced it has entered into a definitive agreement with Cray Inc. to acquire certain assets related to its high-performance computing (HPC) interconnect program. With the agreement, Intel gains access to Cray’s world-class interconnect personnel and intellectual property.

The Cray interconnect team is responsible for the award-winning Gemini interconnect as well as the upcoming Aries interconnect, designed to work in Cray’s next-generation supercomputer, codenamed “Cascade,” which will integrate Intel® Xeon® processors. The transaction is expected to close before the end of the current quarter, subject to customary closing conditions being met.

“Delivering continued advancement in high-performance computing, including breaking the Exascale barrier, requires tremendous innovation in interconnect technology,” said Diane Bryant, vice president and general manager of Intel’s Datacenter and Connected System Group. “The acquisition of Cray’s industry-leading interconnect technology and expertise provides exceptional strategic assets that further enhance Intel’s HPC portfolio. We’re excited about the value this will allow us to bring to our customers.”

Intel, Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: OpenCL Developer Kit Supports New Intel® Core™ Processors

Tue, 24 Apr 2012 15:41:38 -0400

In support of 3rd Generation Intel® Core™ processors, today Intel announced the Intel® SDK for OpenCL Applications 2012. The latest addition to Intel’s line of tools and APIs, the software development kit (SDK) gives developers more programming options on Intel platforms, enabling them to improve application performance and create better user experiences. OpenCL provides consumer video, media, 3D and other visual computing applications an additional capability to make the most of Intel processors and Intel® HD Graphics. Intel SDK for OpenCL Applications 2012 is available to developers as a free download.

Chip Shot: Tap into Your Green Thumb with Intel AppUp℠ center

Tue, 24 Apr 2012 11:58:10 -0400

Celebrate Earth Day straight from your computer thanks to Intel AppUp^{SM center} with Vital Almanac, a guide for growing organic fruits and vegetables. Take pictures of your progress and share them using Snapseed, an app that delivers extraordinary visual enhancements. You can also see how others are celebrating the holiday with iStreamer, a continuous 3D timeline that shows what’s happening around you. Or, if gardening isn’t your forte, maybe your green thumb is better served cutting fruits with our favorite Fruit Ninja.

Chip Shot: Intel Wins Internet Advertising Award

Tue, 24 Apr 2012 11:24:59 -0400

Intel’s Digital Innovation Gazette (DIG) has won the 2012 Internet Advertising Competition Award for Outstanding Achievement in Internet Advertising from the Web Marketing Association. Created and distributed together with Studio One Networks, a content marketing company, DIG is a magazine platform delivering the latest insights, tools and technologies on gaming, graphics, animation, video and programming. The award, honoring excellence in online advertising, recognizes DIG’s achievements in syndication and reaching new audiences. Since launching in November 2010, DIG has already been syndicated to more than 90 websites, reaching software and game developers passionate about digital arts around the world. Learn more about DIG.

Chip Shot: How Does Mobility Uniquely Touch All Aspects of Our Lives?

Tue, 24 Apr 2012 09:25:15 -0400

60 Second Insights, a video series launched earlier this year, brings together a variety of unique perspectives from entertainment, art, technology, business, culture, youth and more to explain how mobility touches various parts of our lives. We continue the conversation with a new set of videos launching today. Featuring leaders from Intel, HP,CrowdOptic and Hipstamatic, this latest group discusses everything from device evolution to the rise of mobile technology to what consumers want when it comes to their technology.

3rd Generation Intel® Core™ Processors Bring Exciting New Experiences and Fun to the PC

Mon, 23 Apr 2012 11:22:02 -0400

World’s First 22nm Quad-Core Processors Bring Up to Twice the Visual Performance for Unmatched Overall PC Experiences

NEWS HIGHLIGHTS

Quad-core processors available starting today in powerful, high-end desktop, laptop, and sleek and beautiful all-in-one designs.
Accelerates Intel’s “Tick-Tock” cadence for first time to simultaneously bring to market the world’s first processors developed on 22nm manufacturing process using innovative 3-D tri-gate transistor technology and a new graphics architecture.
Up to twice the HD media and 3-D graphics performance, as well as significant processor performance, deliver stunning visual experiences from mainstream gaming to HD video editing.
Ultrabook™ devices, all-in-one (AIO) platforms, business PCs and Intelligent systems in retail, healthcare and other industries will benefit from Intel’s newest processors, with formal announcements in the coming months.

SANTA CLARA, Calif., April 23, 2012 – Intel Corporation today introduced the quad-core 3rd generation Intel® Core™ processor family, delivering dramatic visual and performance computing gains for gamers, media enthusiasts and mainstream users alike. Available now in powerful, high-end desktop, laptop and sleek all-in-one (AIO) designs, the new processors are the first chips in the world made using Intel’s 22-nanometer (nm) 3-D tri-Gate transistor technology.

The combination of Intel’s cutting-edge 3-D tri-gate transistor technology and architectural enhancements help make possible up to double the 3-D graphics and HD media processing performance compared with Intel’s previous generation of chips. As a result of the stunning, built-in visual performance, all the things people love to do on their PCs — from creating and editing videos and photos, surfing the Web, watching HD movies or playing mainstream games — are quicker, crisper and more life-like. With as much as 20 percent microprocessor performance improvements and new technologies to speed the flow of data to and from the chips, the new processors further extend Intel’s overall performance leadership.

In the coming months, additional versions of the 3rd generation Intel Core processors will be available to power a new wave of systems ranging from Ultrabook™ devices, to servers and intelligent systems in retail, healthcare and other industries.

"The 3rd generation Intel Core processors were created from the ground up to generate exciting new experiences," said Kirk Skaugen, Intel vice president and general manager of the PC Client Group. "Our engineers have exceeded our expectations by doubling the performance of media and graphics versus the best processors we’ve built until today, which means incredible new visual experiences are here for new all-in-one PCs and upcoming Ultrabook devices. What makes all this possible is the combination of Intel’s leading manufacturing and processor architecture, and our unwavering commitment to drive computing innovations forward."

“Tick-Plus” – The Intel Advantage
The performance gains found in the new processors are due in part to the groundbreaking, three-dimensional structure of the new Intel transistors. Until today, computers, servers and other devices have used only two-dimensional planar transistors. Adding a third dimension to transistors allows Intel to increase transistor density and put more capabilities into every square millimeter of these new processors. Intel has once again re-invented the transistor and delivered an unprecedented combination of performance and energy efficiency, thus sustaining the pace of technology advancement and fueling Moore’s Law for years to come.

Intel engineers also reworked the graphics architecture of the 3rd generation Intel Core processors, helping to deliver dramatic improvements in the overall visual experience. Changing the chips’ architecture while at the same time shrinking the size of the underlying transistors is an acceleration of Intel’s “tick-tock” model. Previously, the company adhered to a strict “tick-tock” model in which a new manufacturing process was introduced in 1 year (the “tick”), and the architecture of the chip (the “tock”) was altered the next. The ability to accelerate the roadmap and change both the chips’ architecture and the manufacturing process at the same time was made possible because Intel is one of the few companies that both designs and manufactures its chips, a method called Integrated Device Manufacturing.

Get Visual and Get Your Game On
The 3rd generation Intel® Core™ processor with Intel® HD Graphics 4000 delivers up to two times better 3-D graphics performance compared to the previous-generation processor, bringing more gaming fun with richer detail at higher resolutions. Intel HD Graphics 4000 supports Microsoft* DirectX 11, OpenGL 3.1 and OpenCL 1.1.

“The 3-D graphics capabilities in 3rd generation Intel Core processors represent a major step forward for PC gaming,” said Gabe Newell, co-founder and managing director of Valve Software, a leading online game provider. “Mainstream gamers are going to have a blast playing titles like our upcoming DOTA 2 on Intel HD Graphics 4000.”

Great visual experience is about more than just gaming. Online video continues to grow dramatically, and is expected to comprise half of all Internet traffic this year.** The key to making video fun is the ability to quickly convert it for online sharing with friends and family. With Intel® Quick Sync Video 2.0 technology built into the new processors, people can convert their videos up to two times faster than even last year’s processors and up to 23 times faster than PCs just three years old.

Experiences, Secured. Platform, Enhanced.
The 3rd generation Intel Core processor also adds security features, including Intel® Secure Key and Intel® OS Guard to safeguard personal data and identity. Intel Secure Key consists of a digital random number generator that creates truly random numbers to strengthen encryption algorithms. Intel OS Guard helps defend against privilege escalation attacks where a hacker remotely takes over another person's system. These two features join existing platform security features such as Intel® Identity Protection Technology (Intel® IPT) and Intel® Anti-Theft technology (Intel® AT) to help make Intel platforms some of the most secure in the industry. When paired with the Intel® Series 7 Chipset, the new processors with Intel IPT can make a portion of the screen unreadable to spyware with the “protected transaction display” feature, helping prevent a hacker from obtaining login credentials that could lead to identity theft.

Platforms based on 3rd generation Intel Core processors also deliver faster data transfer capabilities made possible by USB 3.0 integrated into the Series 7 Platform Controller Hub (PCH) and PCI Express 3.0 integrated into the processor. These next-generation I/O technologies bring bigger data pipes to the platform to keep data moving, minimizing any interruption to the PC experience.

Processor and System Availability
Systems based on quad-core 3rd generation Intel Core processor products will be available beginning this month from leading system makers. Boxed versions of these processors will also be available this month from online, retail and channel resellers. Additional versions of the 3rd generation Intel Core processor products for servers, intelligent systems in retail, healthcare and other industries, Ultrabook devices and laptops and more will be available later this year.

For more information, visit the 3rd generation Intel® Core™ processor multimedia press kit.

Intel, Ultrabook and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchase, including the performance of that product when combined with other products. For more information go to www.intel.com/performance

**Source: Cisco Visual Networking Index Report, February 2012

XOLO X900, First Smartphone with Intel Inside Launches in India Market

Wed, 18 Apr 2012 18:33:32 -0400

XOLO X900 Brings the Best of Intel Computing to Mobile Users in India

XOLO X900 Smartphone from Lava International with Intel Inside®

New Delhi, India, April 19, 2012 – Intel Corporation and Lava International Ltd., one of India’s fastest-growing mobile handset companies, today announced the general availability of the XOLO X900, the first smartphone with Intel inside. The device will be available to customers for purchase beginning 23rd April at a best-buy street price of approximately INR 22000.

Lava also announced its long-term partnership with Croma, a national chain of mega stores of consumer electronics and durables, for promotion and sale of the XOLO X900.

The partnership between Intel and Lava was announced at Mobile World Congress in Barcelona in February. The XOLO X900 is based on Intel’s smartphone reference design featuring the Intel® Atom™ processor Z2460 with Intel® Hyper Threading Technology and supporting HSPA+ 3G connectivity.

The high-performance 1.6 GHz Atom™ processor with Hyper Threading Technology brings speed and multi-tasking performance to consumers’ fingertips. The leading-edge 400 MHz graphics clock and the full 1080p HD video encoding and playback make this phone a perfect entertainment device, providing users with an immersive gaming and video experience. It also features an 8-megapixel camera delivering advanced imaging capabilities including burst mode that allows 10 pictures to be captured in under a second.

The XOLO X900 is housed in a sleek design with a 4.03-inch high-resolution LCD touch screen for crisp text and vibrant images. At launch, the X900 will run on Android Gingerbread*, with a planned over-the -air software upgrade to Android’s Ice Cream Sandwich* platform shortly thereafter. Intel’s technology enables a high-performance user experience, all while maintaining great battery life – up to 5 hours of 3G browsing, 45 hours of audio and 8 hours of talk time1.

“Through XOLO X900, we are happy to bring to the Indian market a device that addresses the needs of those for whom speed and performance matters. After our success in feature phones with over 10 million happy customers in under 3 years, XOLO will be a differentiated player in the fast-growing smartphone segment. The initial reviews of XOLO X900 have been very positive and independent benchmarks clearly point to the fact that when it comes to speed and performance, XOLO X900 is the gold standard,” said Vishal Sehgal, co-founder and director, Lava International.

“The first smartphone with Intel inside is now available to Indian consumers,” said Mike Bell, Intel corporate vice president and general manager of the Mobile and Communications Group. “The boundaries of personal computing are expanding. As we enter the India market with our first smartphone from Lava, the device not only showcases the rich capabilities and user benefits of Intel computing, but also highlights the exciting possibilities of what’s still to come.”

Commenting on the long-term strategic partnership with Lava, Ajit Joshi, MD and CEO, Infiniti Retail Limited, said “We at Croma are extremely pleased to collaborate with Intel and Lava to get this exciting new product into the market. We always endeavor to get the latest and best products first to our consumers and this is a step in that direction. We are very optimistic about the prospects of this exciting new product.”

Starting 23rdApril, the XOLO X900 will be available for purchase to customers from Croma and Xolo.in, followed by availability in other retail chains, general trade and online stores from early May.

About Lava
Lava international is one of the fastest growing brands in Indian mobile market today. The organization started operations only 30 months back and is rapidly growing its market share. “Get the power in your hand” -- with this motto as the guiding principle, Lava embarked on its journey to empower people with innovative products. Today the brand has a wide range of handsets in its portfolio. The company has already expanded its operations in all the states of India and has a network of 1,000 distributors and presence in ~50,000 retail counters.

1 Performance and battery life estimates are based on internal Intel testing using the Intel Atom processor Z2460 Smartphone Reference Design and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Final figures may vary based on final OEM device implementation and usage.

Intel, Atom and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

Lava, XOLO & the LAVA & XOLO logos are trademarks of Lava International Limited.

* Other names and brands may be claimed as the property of others.

Chip Shot: Entertainment, Art and Technology Visionaries Talk Mobile

Wed, 18 Apr 2012 16:45:29 -0400

Where do entertainment, mobility and technology intersect? Artists, CEOs and executives discuss in the latest collection of videos as part of Intel's 60 Second Insights series. Listen to what Dr. Venkatesh Prasad (Ford Motor Company), Brent Weinstein (United Talent Agency), Tim Westergren (Pandora) and artist Charles Muench think about how technology is helping people realize what they need and want when it comes to their entertainment experience.

Chip Shot: Intel's Corporate Citizenship Thrives

Wed, 18 Apr 2012 12:31:58 -0400

Intel ranked fourth on Corporate Responsibility Magazine’s "100 Best Corporate Citizens 2012" list. Intel was selected for its transparency within its corporate sustainability initiatives, including environmental efforts and employee relations. Check out this blog post written by Michael Jacobson, director of Intel’s Corporate Responsibility Office, highlighting Intel’s “strategic objective to care for our people, the planet and inspire the next generation.” Learn more about Intel’s sustainability initiatives.

18 U.S. Schools Named Intel Schools of Distinction Finalists

Wed, 18 Apr 2012 10:37:50 -0400

Schools Honored for Science and Math Programs

NEWS HIGHLIGHTS

18 U.S. schools named Schools of Distinction finalists.
Awards for Math and Science Excellence include cash, goods and services.
Six to be named Intel Schools of Distinction, one a “Star Innovator,” in September.

SANTA CLARA, Calif., April 18, 2012 – Intel Corporation today named 18 U.S. schools as finalists in the 2012 Intel Schools of Distinction Awards.

The winning schools, to be honored in September at an awards reception in Washington, D.C., serve as outstanding examples of leaders in preparing tomorrow’s innovators.

Each of the 18 schools will receive $5,000 from the Intel Foundation and a trip to Washington, D.C. in September when six schools will be named Intel Schools of Distinction. These six schools will each win an additional $5,000 from the Intel Foundation and a package of goods and services with a total value of approximately $500,000 split among the schools.

One of the six schools will also be selected as “Star Innovator” and will receive $25,000 from the Intel Foundation, and additional prizes and services from sponsors.

Intel sponsors the Schools of Distinction Awards to honor schools for implementing innovative math and science programs and serving as models for other schools.

“The schools selected as Intel Schools of Distinction are leaders in preparing their students to become America’s next generation of thinkers and doers,” said Shelly Esque, vice president of Intel’s Corporate Affairs Group and president of the Intel Foundation. “Intel is recognizing these schools as exemplary models of what can be achieved through hard work and innovation in the areas of math and science.”

The Schools of Distinction program honors schools that provide a rich, rigorous science or mathematics curriculum incorporating hands-on investigative experiences which prepare students for 21st century jobs. Programs focus on solving real-life problems as a team and encourage student achievement while helping students become knowledgeable consumers of news and data in order to be active and informed citizens.

The 18 finalist schools are:

Mathematics

Elementary Schools: Dana Elementary School – Dana, N.C.

Forest Hills School – Florence, Ala.

Legacy Elementary School – Madison, Ala.

Middle Schools: Dowell Middle School – McKinney, Texas

St. Therese Chinese Catholic School – Chicago

Technology Access Foundation Academy – Kent, Wash.

High Schools: Baruch College Campus High School – New York

Peachtree Ridge High School – Suwanee, Ga.

School of Science and Engineering – Dallas

Science

Elementary Schools: Gary And Bobbye Jack Minshew Elementary School – McKinney, Texas

Legacy Elementary School – Madison, Ala.

West Melbourne Elementary School for Science – West Melbourne, Fla.

Middle Schools: Edison Computech Middle School – Fresno, Calif.

Ni River Middle School – Spotsylvania, Va.

Penn Alexander School – Philadelphia

High Schools: Boston Latin School – Boston

Gatton Academy – Bowling Green, Ky.

Ossining High School – Ossining, N.Y.

For more information on the Intel Schools of Distinctions Awards visit: www.intel.com/education/schoolsofdistinction.

Intel’s sponsorship of the Schools of Distinction Awards is part of the Intel® Education Initiative, a sustained public-private partnership with governments in more than 50 countries. Through this $100 million a year initiative, Intel delivers programs that improve the effective use of technology to enhance 21st century skills and encourages excellence in mathematics, science and engineering. For more information, visit: www.intel.com/education.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Intel Reports First-Quarter Revenue of $12.9 Billion

Tue, 17 Apr 2012 15:59:15 -0400

SANTA CLARA, Calif., April 17, 2012 – Intel Corporation today reported quarterly revenue of $12.9 billion, operating income of $3.8 billion, net income of $2.7 billion and EPS of $0.53. The company generated approximately $3.0 billion in cash from operations, paid dividends of $1.0 billion and used $1.5 billion to repurchase stock.

“The first quarter was a solid start to what’s expected to be another growth year for Intel,” said Paul Otellini, Intel president and CEO. “In the second quarter we’ll see the first Intel-based smartphones in the market, ship products based on 22nm tri-gate technology in high volume, and accelerate the ramp of our best server product ever, providing a tremendous foundation for growth in 2012 and beyond.”

Business Outlook

Intel’s Business Outlook does not include the potential impact of any mergers, acquisitions, divestitures or other business combinations that may be completed after April 17.

Q2 2012 (GAAP, unless otherwise stated)

Revenue: $13.6 billion, plus or minus $500 million.
Gross margin percentage: 62 percent and 63 percent Non-GAAP (excluding amortization of acquisition-related intangibles), both plus or minus a couple of percentage points.
R&D plus MG&A spending: approximately $4.6 billion.
Amortization of acquisition-related intangibles: approximately $80 million.
Impact of equity investments and interest and other: loss of approximately $20 million.
Depreciation: approximately $1.6 billion.

Full-Year 2012 (GAAP, unless otherwise stated)

Gross margin percentage: 64 percent and 65 percent Non-GAAP (excluding amortization of acquisition-related intangibles), both plus or minus a few percentage points, unchanged.
Spending (R&D plus MG&A): $18.3 billion, plus or minus $200 million, unchanged.
Amortization of acquisition-related intangibles: approximately $300 million, unchanged.
Depreciation: $6.4 billion, plus or minus $100 million, down $100 million from prior expectations.
Tax Rate: approximately 28 percent down from prior expectations of 29 percent.
Full-year capital spending: $12.5 billion, plus or minus $400 million, unchanged.

For additional information regarding Intel’s results and Business Outlook, please see the CFO commentary at: www.intc.com/results.cfm.

Status of Business Outlook

Intel’s Business Outlook is posted on intc.com and may be reiterated in public or private meetings with investors and others. The Business Outlook will be effective through the close of business June 15 unless earlier updated; except that the Business Outlook for amortization of acquisition-related intangibles, impact of equity investments and interest and other, and tax rate, will be effective only through the close of business on April 24. Intel’s Quiet Period will start from the close of business on June 15 until publication of the company’s second-quarter earnings release, scheduled for July 17. During the Quiet Period, all of the Business Outlook and other forward-looking statements disclosed in the company’s news releases and filings with the SEC should be considered as historical, speaking as of prior to the Quiet Period only and not subject to an update by the company.

GAAP Financial Comparison
Quarterly
	Q1 2012	Q4 2011	vs. Q4 2011
Revenue	$12.9 billion	$13.9 billion	down 7%
Gross Margin	64.0%	64.5%	down 0.5 pts.
Operating Income	$3.8 billion	$4.6 billion	down 17%
Net Income	$2.7 billion	$3.4 billion	down 19%
Earnings Per Share	53 cents	64 cents	down 17%

Non-GAAP Financial Comparison
Quarterly
	Q1 2012	Q4 2011	vs. Q4 2011
Gross Margin	65.1%	65.4%	down 0.3 pts.
Operating Income	$4.0 billion	$4.8 billion	down 16%
Net Income	$2.9 billion	$3.5 billion	down 18%
Earnings Per Share	56 cents	67 cents	down 16%
Non-GAAP results exclude the amortization of acquisition-related intangible assets and the related income tax effect of these charges.

Q1 Key Financial Information (GAAP)

PC Client Group revenue of $8.5 billion, down 7 percent sequentially.
Data Center Group revenue of $2.5 billion, down 10 percent sequentially.
Other Intel® architecture group revenue of $1.1 billion, down 2 percent sequentially.
The first quarter of 2012 includes full-quarter revenue contributions from last year’s McAfee and Infineon Wireless Solutions acquisitions of $935 million.
The first quarter of 2012 had 13 weeks while the first quarter of 2011 had 14 weeks.

Risk Factors

The above statements and any others in this document that refer to plans and expectations for the second quarter, the year and the future are forward-looking statements that involve a number of risks and uncertainties. Words such as “anticipates,” “expects,” “intends,” “plans,” “believes,” “seeks,” “estimates,” “may,” “will,” “should” and their variations identify forward-looking statements. Statements that refer to or are based on projections, uncertain events or assumptions also identify forward-looking statements. Many factors could affect Intel’s actual results, and variances from Intel’s current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following to be the important factors that could cause actual results to differ materially from the company’s expectations.

Demand could be different from Intel's expectations due to factors including changes in business and economic conditions, including supply constraints and other disruptions affecting customers; customer acceptance of Intel’s and competitors’ products; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers. Uncertainty in global economic and financial conditions poses a risk that consumers and businesses may defer purchases in response to negative financial events, which could negatively affect product demand and other related matters.
Intel operates in intensely competitive industries that are characterized by a high percentage of costs that are fixed or difficult to reduce in the short term and product demand that is highly variable and difficult to forecast. Revenue and the gross margin percentage are affected by the timing of Intel product introductions and the demand for and market acceptance of Intel's products; actions taken by Intel's competitors, including product offerings and introductions, marketing programs and pricing pressures and Intel’s response to such actions; and Intel’s ability to respond quickly to technological developments and to incorporate new features into its products.
Intel is in the process of transitioning to its next generation of products on 22nm process technology, and there could be execution and timing issues associated with these changes, including products defects and errata and lower than anticipated manufacturing yields.
The gross margin percentage could vary significantly from expectations based on capacity utilization; variations in inventory valuation, including variations related to the timing of qualifying products for sale; changes in revenue levels; segment product mix; the timing and execution of the manufacturing ramp and associated costs; start-up costs; excess or obsolete inventory; changes in unit costs; defects or disruptions in the supply of materials or resources; product manufacturing quality/yields; and impairments of long-lived assets, including manufacturing, assembly/test and intangible assets.
The tax rate expectation is based on current tax law and current expected income. The tax rate may be affected by the jurisdictions in which profits are determined to be earned and taxed; changes in the estimates of credits, benefits and deductions; the resolution of issues arising from tax audits with various tax authorities, including payment of interest and penalties; and the ability to realize deferred tax assets.
Gains or losses from equity securities and interest and other could vary from expectations depending on gains or losses on the sale, exchange, change in the fair value or impairments of debt and equity investments; interest rates; cash balances; and changes in fair value of derivative instruments.
The majority of Intel’s non-marketable equity investment portfolio balance is concentrated in companies in the flash memory market segment, and declines in this market segment or changes in management’s plans with respect to Intel’s investments in this market segment could result in significant impairment charges, impacting restructuring charges as well as gains/losses on equity investments and interest and other.
Intel's results could be affected by adverse economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates.
Expenses, particularly certain marketing and compensation expenses, as well as restructuring and asset impairment charges, vary depending on the level of demand for Intel's products and the level of revenue and profits.
Intel’s results could be affected by the timing of closing of acquisitions and divestitures.
Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust, disclosure and other issues, such as the litigation and regulatory matters described in Intel's SEC reports. An unfavorable ruling could include monetary damages or an injunction prohibiting Intel from manufacturing or selling one or more products, precluding particular business practices, impacting Intel’s ability to design its products, or requiring other remedies such as compulsory licensing of intellectual property.

A detailed discussion of these and other factors that could affect Intel’s results is included in Intel’s SEC filings, including the report on Form 10-K for the year ended Dec. 31, 2011.

Earnings Webcast

Intel will hold a public webcast at 2 p.m. PDT today on its Investor Relations website at www.intc.com. A webcast replay and MP3 download will also be available on the site.

Intel plans to report its earnings for the second quarter of 2012 on July 17. Immediately following the earnings report, the company plans to publish a commentary by Stacy J. Smith, senior vice president and chief financial officer, at www.intc.com/results.cfm. A public webcast of Intel’s earnings conference call will follow at 2 p.m. PDT at www.intc.com.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: Intel, Micron Win Semiconductor of the Year Award

Tue, 17 Apr 2012 15:39:46 -0400

Intel Corporation and Micron Technology, Inc., today announced that their industry-leading 20nm NAND was named Semiconductor of the Year in the 10th Annual Insight Awards hosted by UBM TechInsights. The Insight Awards recognize achievements in the semiconductor and electronics industry. Devices are analyzed by UBM’s team of experts and subjected to a rigorous judging process.

Chip Shot: Intel Powers the NAB Show Theater

Mon, 16 Apr 2012 10:57:46 -0400

If all the world’s a stage at NAB, then all the players have a bit of Intel in them. From workstations, laptops, compositing servers, the new SightDeck system to the NewTek TriCaster 850 EXTREME, Intel® Xeon® E5 and Intel® Core™ i7 processors are powering this real world studio. Whether it's video graphics, animation, camera feeds, audio or lighting, Intel is behind the scenes to help bring the sight, sound and touch for the NAB Show's theater to life. At the Intel booth # SL 12810, the company will also showcase products and content from hardware and software partners including HP, Dell, Magix, Cakewalk, Adobe, Autodesk and NewTek.

Intel Announces Intel® Solid-State Drive (SSD) 330 Series

Mon, 16 Apr 2012 10:29:54 -0400

Now Available Through Worldwide Retail and E-Tail Outlets, Intel SSD 330 Series Offers Latest SSD Technology at Affordable Prices

NEWS HIGHLIGHTS

New Intel SSD 330 Series offers boosted system performance for the budget-conscious PC enthusiast.
An ideal PC upgrade, Intel SSD 330 Series is a SATA 6Gb/s-based SSD that blends performance, Intel quality and value.
Available in the most popular capacities, 60-, 120- and 180GB, Intel's newest SSD starts at a suggested channel price of $89.

SANTA CLARA, Calif., April 16, 2012 – Intel Corporation announced today the Intel® Solid-State Drive 330 Series (Intel® SSD 330 Series), a SATA 6 gigabit-per-second (Gb/s) solid-state drive (SSD) that gives consumers a more affordable entry into the accelerated storage performance of SSDs.

Ideal for upgrading desktop or notebook PCs, the Intel SSD 330 Series offers the price-conscious PC enthusiast a brand-name SSD that blends performance, Intel quality and value. Offered in the most popular capacity points, 60 gigabytes (GB), 120GB and 180GB, the Intel SSD 330 Series boosts overall system performance and responsiveness for a broad range of applications.

"An SSD is still the single best upgrade you can make to your existing PC, and the Intel SSD 330 Series gives users the latest Intel SSD technology at a price to meet their budget," said James Slattery, product line manager for client SSDs, Intel Non-Volatile Memory Solutions Group. "Backed by Intel's rigorous testing process, the Intel SSD 330 Series offers our users the speed they need at a great price, backed by world-class manufacturing, reliability and tech support."

Unlike a traditional hard disk drive (HDD) with spinning disks and moveable parts, SSDs offer a more rugged, low-power storage solution that dramatically improves system performance to keep up with today's I/O-intensive applications. The Intel SSD 330 Series contains Intel 25-nanometer (nm) multi-level cell (MLC) NAND memory. Its SATA 6Gb/s interface doubles the bandwidth of its current SATA 3Gb/s Intel® SSD 320 Series, providing up to 500 megabytes-per-second (MB/s) sequential read speeds and up to 450MB/s sequential write speeds for faster data transfers. Random read performance can go up to 22,500 Input-Output Operations Per Second (IOPS) and 33,000 write IOPS to boost overall application and system responsiveness, significantly outperforming a typical consumer hard disk drive.

Intel offers a broad range of SSD choices within four product families. The Intel SSD 300 Family is aimed at entry-level, mainstream client users. The Intel SSD 500 Family offers more fully featured, higher-performing client SSDs for computer and gaming enthusiasts. The Intel SSD 700 and Intel SSD 900 Families are targeted for data center applications.

The Intel SSD 330 Series comes in a standard 2.5-inch/9.5mm form factor as a replacement to a slower-performing HDD. It can be used in a dual-drive desktop PC configuration to speed up boot times and applications speeds, or as a single-drive notebook upgrade.

Available beginning today at worldwide retailers and online e-tailers, the Intel SSD 330 Series is offered at the suggested channel price of $89 for a 60GB drive, $149 for a 120GB drive and $234 for a 180GB drive. It is also backed by a 3-year limited warranty.

To download the multimedia press kit go to www.intel.com/newsroom/ssd. For more information on Intel SSDs go to www.intel.com/go/ssd or follow Intel SSDs on Twitter (@intelssd), Facebook (www.intel.com/go/ssdfacebook or communities.intel.com).

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: Ultrabook Online Experience Puts You in the Director's Chair

Fri, 13 Apr 2012 11:09:30 -0400

A unique online experience is letting visitors at intel.com/ultrabook direct their own video based on Intel’s newest TV commercials for Ultrabook. Launched today in the U.S. and widening to 50 countries across 26 languages through the end of April, the interactive experience is part of Intel’s biggest marketing campaign since 2003. Expanding the commercials and making them more personal, fun and sharable, the interactive feature asks individuals to make real-time decisions that seamlessly change the story and action scenes. There are over 6,900 unique options a user can experience when personalized through Facebook. For example, at certain points the consumer must choose the path of the hero who personifies the Ultrabook versus one that exemplifies the opposite -- Ultra Responsive vs. Not So Quick, Ultra Sleek vs. Not So Cool, Long Lasting vs. Totally Drained and so on. Via Facebook Connect, such features as the individual’s profile picture showing up here and there adds to the personalized fun.

Chip Shot: Let's Hear it For Spring Break with Intel AppUp℠ center!

Thu, 12 Apr 2012 18:20:27 -0400

This year, let Intel AppUp^{SM center} help plan your spring break vacation by using HRS Hotel Portal, a hotel search service with access to more than 250,000 hotels worldwide. Once you reach your destination, plug into Public Radio On Location Win, a geo-active audio player that brings up rich stories, music and interviews based on your location. To learn about all the nearest attractions, tap into Local Recon and Arrivalguides To Go, and get your vacation started!

Intel® Solid-State Drive 910 Series Delivers High Performance, Endurance and Reliability for Data Center Tiering and Caching

Thu, 12 Apr 2012 03:01:01 -0400

New Intel 900 SSD Family Expands SSD Product Line with PCIe Interface SSD for Accelerated Data Center Storage

NEWS HIGHLIGHTS

PCIe-based 400GB and 800GB Intel SSD 910 Series provides extreme performance, endurance and reliability for rigorous data center demands.
Intel SSD 910 Series offers easy-to-install, seamless post-deployment server storage upgrade with no changes to existing server design.
Using Intel High Endurance Technology, Intel SSD 910 offers 10 full drive writes a day for 5 years for 30x endurance.*

SANTA CLARA, Calif., April 12, 2012 – Intel Corporation introduced today the Intel® Solid-State Drive 910 Series (Intel® SSD 910 Series), a super high-performing SSD to address rigorous data center storage demands driven by cloud computing, virtualization and online transactions.

The Intel SSD 910 Series delivers accelerated storage performance, endurance and reliability critical to today's data center performance applications. It includes Intel High Endurance Technology and optimized multi-level cell (MLC) 25-nanometer NAND flash memory, that allows up to 10 full drive writes a day for 5 years, or a 30x endurance improvement* over its standard MLC-based flash products, for a cost-effective storage solution.

The Intel SSD 910 is PCIe-based and offers an easy-to-install, seamless post-deployment server storage upgrade that requires no changes to existing server design. It can be used in storage tiering and caching of hot files for high-performance processing and access to mission-critical data. One Intel 910 SSD can replace multiple 15K rpm hard disk drives (HDDs) to not only save on space and power consumption, but also improve sequential performance and storage scalability and reduce latencies. It is built using an Intel controller and Intel SSD management firmware. The firmware is optimized for less wear and includes NAND error reduction and system error management.

"The Intel SSD 910 Series is a complete solution that delivers on all fronts: highperformance, endurance and reliability, making it ideal for replacing I/O-intensive HDDs," said Roger Peene, director of data center SSD marketing for the Intel Non-Volatile Memory Solutions Group. "As a leader in SSD technology, data center IT professionals can have confidence in a tier-one, easy-to-install SSD solution backed by Intel quality, reliability and technical support."

"Supermicro works closely with leading technology companies so we can offer our customers Data Center Optimized (DCO) server solutions with the highest performance and highest efficiency," said Tau Leng, general manager of High Performance Computing at Super Micro Computer Inc. "With the Intel SSD 910, server systems can achieve higher levels of CPU utilization to take advantage of increased processing power from advanced products like the Intel® Xeon® Processor E5-2600 Series. This is yet another example of working with Intel to test and qualify products, so we can lower our customers' total cost of ownership and reduce their time-to-market."

The Intel SSD 910 Series expands Intel's offerings for data center applications with its first entry in the 900 family of its highest-performing, PCIe-based SSDs. The Intel SSD 900 Family joins Intel's other high-volume SSD solutions for the data center including the Intel 700 SSD Family of SATA-based SSDs with High Endurance Technology and the Intel SSD 300 Family of SATA SSDs for a broad range of server and storage applications.

Performance measures of the Intel SSD 910 Series 800GB drive include 2 gigabytes-per-second (GB/s) sustained sequential reads and 1GB/s sequential writes; up to 180,000 4K random read Input-Output Operations Per Second (IOPS) and 75,000 4K random write IOPS. It comes in 400GB and 800GB capacities. Samples are now available for data center customers to begin quality and validation cycles. General production availability is scheduled for mid-2012.

Pricing for the Intel SSD 910 Series is $1,929 for the 400GB capacity and $3,859 for 800GB. It comes with a 5-year limited warranty. See full warranty details at: www.intel.com/support/ssdc/hpssd/sb/CS-029645.htm.

Intel® SSD 910 Series For Extreme Data Center Storage Performance - Intel Corporation introduced today the Intel® Solid-State Drive 910 Series (Intel® SSD 910 Series), a super high-performing SSD to address rigorous data center storage demands driven by cloud computing, virtualization and online transactions. The Intel SSD 910 Series delivers accelerated storage performance, endurance and reliability critical to today’s data center performance applications.

Intel, Xeon and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

*Based on 8K random writes and comparing Intel HET SSD solutions to SSD solutions based on standard Intel MLC NAND flash memory.

Chip Shot: 'Inside the Music': Intel First to Go Behind the Scenes of Pandora Music Genome Project

Wed, 11 Apr 2012 14:31:38 -0400

This morning Pandora announced the "Inside the Music" program, presented by Intel. The program highlights Intel-Inspired Ultrabook™ systems and goes behind-the-scenes of the Pandora Music Genome Project, giving listeners interactive, in-depth views of the music they love. The "Inside the Music" program will explore six musical genres and the unique characteristics of each genre to create a memorable music experience for consumers. Additionally, for the first time ever, the program will enable listeners to launch new Pandora stations based on a specific track feature such as guitar effects, backbeat and vocal harmony.

Chip Shot: Renren Aims to Bring Safer Computing with Intel Identity Protection Technology

Wed, 11 Apr 2012 13:27:37 -0400

Intel, Chinese ISV Feitian and RenRen (China’s top social media networking site) announced today that in the future Ultrabook users will benefit from the security enhancements provided by Intel Identity Protection Technology. See the full press release for details, and view the IDF press kit for more information on this and other announcements from the Intel Developer Forum in Beijing, China.

Chip Shot: Intel Offers Small Businesses a Technology Advantage

Wed, 11 Apr 2012 11:34:04 -0400

Small business owners should be free to focus on their businesses and not left worrying about the virus protection, security and software updates for their PCs. That’s why today, at IDF Beijing, Intel announced the availability of Intel® Small Business Advantage (Intel® SBA) for laptop and desktop PCs based on the 2nd Generation Intel® Core™ processor family. Designed with the small business owner in mind, Intel SBA automatically enables PCs to run at a higher performance, be more secure, and back up data. For additional details on other news from IDF Beijing, read the press release.

Intel Honors 21 Companies with Preferred Quality Supplier and Achievement Awards

Wed, 11 Apr 2012 10:27:39 -0400

SANTA CLARA, Calif., April 11, 2012 – Intel Corporation today announced the 19 companies to receive the 2011 Intel Preferred Quality Supplier (PQS) award that recognizes commitment to quality and performance excellence. These companies distinguish themselves from the thousands of suppliers that work with Intel by exceeding high expectations and tough performance goals while demonstrating industry-leading commitment to quality.

In addition to the PQS award, Intel recognized two suppliers with the Achievement Award for their extraordinary accomplishments in the areas of velocity, customer orientation and reduced cycle time. The 2011 PQS and Achievement winners will be honored at a ceremony tonight in Santa Clara, Calif.

"This year's Intel Preferred Quality Supplier award winners have truly distinguished themselves by driving and executing to world-class supply chain performance in execution, innovation and quality," said Jaclyn A. Sturm, vice president, Technology and Manufacturing Group and general manager of Global Sourcing and Procurement. "2011 was a year that tested all aspects of the supply chain from core challenges of business continuity and affordability to the need for continuous innovation, velocity improvements and growing expectations of sustainability. These winners distinguished themselves not only in their ability to overcome, but their ability to excel in the midst of these challenges."

"Intel's 2011 Preferred Quality Suppliers have excelled across an extremely demanding set of expectations, and have distinguished themselves as industry leaders in technology innovation, supply chain excellence, and corporate responsibility," added Robert Bruck, corporate vice president and general manager of Technology Manufacturing Engineering. "These suppliers have made a substantial contribution to Intel's success through their commitment to quality in support of Intel's industry-leading silicon, packaging and test technologies."

The PQS award is part of Intel's Supplier Continuous Quality Improvement (SCQI) program that encourages suppliers to innovate and continually improve. To qualify for PQS status, suppliers must score at least 80 percent on a report card that assesses performance and ability to meet cost, quality, availability, delivery, technology and environmental, social and governance goals. Suppliers must also achieve 80 percent or greater on a challenging improvement plan and demonstrate solid quality and business systems. Additional information about the SCQI program is available at www.intel.com/go/quality.

The PQS winners provide Intel with the following products or services:

Advantest Corporation supplies testers, test handlers, and test interface products.
Applied Materials, Inc. supplies semiconductor manufacturing equipment, software and support services.
ASML supplies semiconductor lithography equipment.
Cabot Microelectronic Corporation supplies chemical mechanical polishing slurries.
Daewon Semiconductor Packaging Industrial Co., Ltd. supplies plastic injected molded trays.
DISCO Corporation supplies cutting, grinding, and polishing equipment and services.
DuPont AirProducts NanoMaterials L.L.C. supplies chemical mechanical planarization slurries.
Ebara Corporation supplies electroplaters, chemical mechanical polishers and pumps and abatement systems.
FUJIFILM Electronic Materials supplies formulated chemicals, developers, precursors, slurries and advanced photoresists.
KLA-Tencor Corporation supplies inspection and metrology capital equipment and services.
Marvell Semiconductor supplies application-specific integrated circuit semiconductor products and engineering resources.
Mitsubishi Gas Chemical Company, Inc. supplies chemicals for semiconductor device manufacturing.
Murata Manufacturing Co., Ltd. supplies multi-layer ceramic capacitors.
Rofin-Baasel supplies laser mark equipment.
Samsung Electro-Mechanics Co., Ltd. supplies flip chip substrates.
Siliconware Precision Industries Co., Ltd. supplies semiconductor assembly and test services.
STATS ChipPAC Ltd. supplies full turnkey packaging and test services.
TAIYO YUDEN CO., LTD. supplies ceramic capacitors, inductors, and filters.
Tosoh Quartz Inc. supplies quartzware for semiconductor wafer processing equipment.

The Achievement winners are the following:

Nikon Corporation awarded for velocity.
Powertech Technology Inc. awarded for customer orientation & cycle time reduction.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Intel Honors Nine Companies with Supplier Continuous Quality Improvement Award

Wed, 11 Apr 2012 10:27:20 -0400

SANTA CLARA, Calif., April 11, 2012 – Intel Corporation today announced the nine winners of the company's most prestigious award for suppliers, the Supplier Continuous Quality Improvement (SCQI) award. This honor, which recognizes outstanding commitment to quality and performance excellence, distinguishes these suppliers as world-class within Intel's greater supply chain.

Providing products and services deemed essential to Intel's business success, the 2011 winners will be honored at a ceremony tonight in Santa Clara, Calif. "Intel's SCQI award winners are role models for the continuous quality improvement cycle needed to deliver leading-edge products and services at sustained levels of excellence," said William Holt, senior vice president and general manager of Intel's Technology and Manufacturing Group. "We are pleased to recognize their exceptional accomplishments."

"Our suppliers play a crucial role in our ability to deliver return to our investors and to delight our customers," said Brian Krzanich, senior vice president and chief operating officer. "This year's nine SCQI winners have distinguished themselves by demonstrating continuous improvement in innovation, affordability, agility, customer responsiveness, and environmental sustainability goals. Their results are world class."

The SCQI award is part of Intel's SCQI program, which encourages Intel's key suppliers to strive for excellence and continuous improvement. To qualify for SCQI status, suppliers must score at least 95 percent on a report card that assesses performance and ability to meet cost, quality, availability, delivery, technology and environmental, social and governance goals. Suppliers must also achieve 90 percent or greater on a challenging improvement plan and demonstrate solid quality and business systems. Additional information about the SCQI program is available at www.intel.com/go/quality.

The SCQI winners provide Intel with the following products or services:

Hitachi High-Technologies Corporation supplies etch and metrology equipment.
Hitachi Kokusai Electric Inc. supplies diffusion furnaces.
JSR Corporation supplies advanced photoresists, packaging materials and chemical mechanical planarization consumables.
JX Nippon Mining & Metals supplies sputtering targets for physical vapor deposition process.
Senju Metal Industry Co., Ltd. supplies soldering material.
SHINKO ELECTRIC INDUSTRIES CO., LTD. supplies plastic laminated package and heat spreaders.
Siltronic supplies polished and epitaxial silicon wafers.
SUMCO Corporations supplies 200mm and 300mm polished epitaxial silicon wafers.
Tokyo Electron Limited supplies coater-developers, dry etch, wet etch and test systems.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Intel, Beijing Municipal Government and Chinese Academy Of Sciences Establish 'Internet of Things' Joint Research

Tue, 10 Apr 2012 22:09:35 -0400

INTEL DEVELOPER FORUM, Beijing, April 11, 2012 – Intel Corporation announced today a joint agreement with the Beijing Municipal Government and Institute of Automation of Chinese Academy of Sciences to establish "China Intel Internet of Things" (IoT) Joint Labs to collaborate on IoT-related core technology research, development and business model innovation. The three organizations will invest 200 million RMB (US$31.7 million) over the next 5 years.

IoT is a global technology evolution through which data from billions of devices are seamlessly connected, intelligently managed and securely interacting over a network. This enables people, devices and systems to turn data into useful information and valued services.

The foundation of the joint research will address the core technologies associated with IoT including sensing, networking and processing, among others that will help address computing, storage and communication challenges of massive-scale systems derived from the large amounts of data gathered.

Tan Tieniu, director of National Laboratory of Pattern Recognition Institute of Automation of Chinese Academy of Sciences, and Jesse Fang, vice president of Intel Labs and managing director of Intel Labs China, were named co-presidents of the China Intel IoT Joint Labs.

"The China Intel IoT joint labs is the largest of its kind that Intel has participated in research collaboration in China, and it is unique in that Intel not only contributed funding but also employees as dedicated senior research leaders," said Fang. "New applications from personalized energy management to smart traffic control to smart cities will be made possible by the research conducted at these labs."

Intel Developer Forum
IDF spans the world of mobility, digital enterprise, digital home, and technology and research. Held at the China National Convention Center on April 11-12, the event is geared toward the Chinese market in support of local innovation and Intel's industry leadership in the region. Next up on the IDF schedule is a 1-day conference in Brazil on May 15 and a 3-day event in San Francisco, Sept. 11-13 at Moscone Center West. Further information is available at www.intel.com/idf.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Intel Developer Forum: 'Collaborative Innovation' Key to Growth for Intel and Chinese Markets

Tue, 10 Apr 2012 21:22:48 -0400

New Technologies and Joint Lab Announcements to Advance More Secure, Connected Computing Experiences from Devices to the Cloud

NEWS HIGHLIGHTS

Intel® Core™ processors with Intel® Small Business Advantage (Intel® SBA) are now available, providing additional tools for PCs to help small businesses increase security and productivity.
Coming this quarter, Intel® HD Graphics 2500/4000 provides amazing 3-D graphics, further enhancing the resolution and visual detail of mainstream games and more.
New, lab-to-lab collaborations with Intel Labs China, Lenovo* address the challenges in the mobile Internet area and China Mobile Research Institute* to apply Intel® architecture to wireless base stations to power the next-generation mobile network infrastructure.

INTEL DEVELOPER FORUM, Beijing, April 11, 2012 – Throughout Intel Corporation’s developer forum that starts today, company executives emphasized the importance of collaborating with China’s government and industry to help create new business and innovation opportunities for Intel and its 14 million developers worldwide. The management team detailed its vision of how such collaborations could potentially spawn the next-generation of advances in business, consumer electronics and many more industries around the globe.

“The impact of major global trends, such as the rapidly growing middle class as well as the explosive growth of connected, mobile Internet and cloud computing traffic, is playing out ten-fold in China,” said Sean Maloney, executive vice president of Intel Corporation and chairman of Intel China.

For example, China became the largest PC market in the world last year, growing a remarkable 13 percent in 2011 and now represents 20 percent of all PC demand, according to IDC, a global industry analyst firm. In addition, IDC shows servers in China are growing at more than eight times the rate of the worldwide average over the past 5 years, making the country the second-largest data center market segment in the world. With more than 1 billion subscribers**, China is also the world’s largest segment for mobile phones.

To address these and other opportunities, Intel executives speaking in Beijing highlighted several technology advancements and local collaborations designed to bring richer, more connected computing experiences from the cloud to computing devices of all types.

The announcements included the introduction of Intel® Small Business Advantage (SBA) designed to help maintain and protect PCs automatically and improved visual experience with built-in visuals on Intel’s forthcoming 3rd generation Intel Core products with Intel® HD Graphics 2500/4000. The company also revealed that Intel Labs China will work closely with leading Chinese OEMs, operators and municipalities for ongoing technology research and development in China.

In his first speech since being appointed chairman of Intel China last year, Maloney opened the company’s largest two-day technical conference in Asia by noting how overcoming barriers in technology represents more than just physics or engineering problem.

“As the world continues to advance, so too must semiconductor technology, and that is never more evident than today with the pending release of Tri-Gate transistors and 22 nm process technology,” said Maloney. “Few individuals and industries will be untouched as powerful microprocessors, Internet-connections, and user experience breakthroughs are applied across the worlds of business, healthcare, education and the society at large.”

Transforming the Personal Computing Experience

During his keynote presentation, Kirk Skaugen, vice president and general manager of Intel’s PC Client Group discussed how Intel is helping drive a dramatic change in the personal computing experience for consumers and businesses with new hardware, software and solutions. Ultrabook™ devices have already begun this transformation, and Skaugen showcased numerous systems on stage and reiterated that more than 75 designs are planned for 2012 with many touch-enabled systems expected. This next wave of Ultrabook devices, powered by 3rd generation Intel® Core™ processors with Intel® HD Graphics 2500/4000, will bring significant performance improvements for even greater computing experiences.

To address the small business segment without IT support, Skaugen also announced Intel SBA will be available on the 2nd generation Intel® Core™ processors. With Intel SBA, small businesses can maximize business productivity by keeping PCs performing at an optimal level while securing data by reducing the risk of virus disruptions, leakage of confidential data and data loss. Intel SBA is a simple-to-use integrated hardware and software solution that automatically provides regular software updates, strengthens security defenses and conducts maintenance tasks after-hours, even if the computer is turned off. OEMs supporting the Intel Small Business Advantage solution include Asus*, Dell*, Fujitsu* and Lenovo* as well as multiple local-OEMs around the world.

To help address online fraud, a common concern for consumers today, all Ultrabook devices will now include Intel® Identity Protection Technology, enabling a more secure and convenient way to access popular websites2. Skaugen announced that RenRen*, China’s most popular social networking website, will incorporate Intel Identity Protection Technology as part of its focus on providing secure online experience for its users. Additionally, he disclosed relationships with Feitian Technologies* and DynamiCode Company*, both leading-edge second factor authentication security solution services that will incorporate Intel Identity Protection Technology into their products.

Collaborating for Datacenter and Cloud Success

During her keynote on the second day of the conference, Diane Bryant, vice president and general manager of Intel’s Datacenter and Connected Systems Group, will discuss how the rapid growth of users, devices and data is transforming information technology while also creating new opportunities for developers.

With more than 15 billion connected devices expected by 20153 – and the data center and cloud computing opportunities that support this level of connected devices – Bryant will say the key is open, standards-based solutions such as those defined by the Intel® Cloud Builders Program.

The Intel® Cloud Builders program enables ecosystem leaders to build and optimize the cloud infrastructure using open-standard solutions optimized for Intel architecture. Intel Cloud Builders brings together tools and best practices, including more than 70 reference architectures from a range of industry-leading cloud infrastructure systems and solutions providers, to address key challenges facing data center and cloud deployments such as security, manageability, and energy efficiency.

Bryant will share that the newly introduced Intel® Xeon processors are at the heart of the data center. The Intel Xeon E5-2600 product family is designed to scale and handle three times more data traffic than today, be more efficient and secure. With 80 percent more performance1,4 and 50 percent more performance per wattpercent1,5 compared to previous generations, the new Intel Xeon processors address the requirements of an ever-growing connected world.

Intel has extended its leadership in data center technology and product innovation with a strong and well-balanced portfolio of processors, developer resources and support that addresses today’s workload challenges for key segments, including the emerging micro server category. Bryant will outline details of the company’s 2012 processor roadmap for this category, and highlight how it continues to help customers deliver new levels of power efficiency and density while allowing them to also benefit from common software compatibility across Intel-based micro servers and traditional servers.

Intel Labs China: Aligning Research Collaboration and Innovation

Emphasizing the importance of ongoing research with local partners in China, Intel Labs announced new joint research collaboration efforts with Lenovo* and China Mobile*. Intel and Lenovo’s new lab-to-lab collaborative research efforts will address challenges in the mobile Internet area, such as security, context aware computing, cross screen experience and energy efficiency.

The China Mobile Research Institute (CMRI) is applying Intel architecture to wireless base stations to power next-generation mobile network infrastructure. As part of CMRI’s Cooperative Radio Access Architecture (CRAN) vision, Intel Labs China and CMRI are engaging in research and ecosystem development to increase the speed and efficiency telecommunications networks through greater processing power and general computing capabilities. With CMRI and other ecosystem partners, Intel has produced a reference design prototype that demonstrates considerable improvements for lowering total cost of ownership. For example, IA signal processing-enabled CRAN technology can save telecommunications operators up to 15 percent in capital expenditures and reduce operations costs up to 50 percent, largely through power savings.

Intel Developer Forum

IDF spans the worlds of mobility, digital enterprise, digital home, and technology and research. Held at the China National Convention Center on April 11-12, the event is geared toward the Chinese market in support of local innovation and Intel’s industry leadership in the region. Next up on the IDF schedule is a one-day conference in Brazil on May 15 and a 3-day event in San Francisco, which will be held Sept. 11-13 at Moscone Center West. Further information is available at www.intel.com/idf.

Intel, Intel Core, Intel Xeon, Ultrabook and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

** China Ministry of Industry and Information Technology

1 Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to www.intel.com/performance.

2 IPT disclaimer:No system can provide absolute security under all conditions. Requires an Intel® Identity Protection Technology-enabled system, including a 2nd gen Intel® Core™ processor enabled chipset, firmware and software, and participating website. Consult your system manufacturer. Intel assumes no liability for lost or stolen data and/or systems or any resulting damages. For more information, visit http://ipt.intel.com.

3 (Connect devices) Source: “Worldwide Device Estimates Year 2020 - Intel One Smart Network Work” forecast

4 (Generational Performance) Source: Performance comparison using best submitted/published 2-socket server results on the SPECfp*_rate_base2006 benchmark as of 6 March 2012. Baseline score of 271 published by Itautec on the Servidor Itautec MX203* and Servidor Itautec MX223* platforms based on the prior generation Intel® Xeon® processor X5690. New score of 492 submitted for publication by Dell on the PowerEdge T620 platform and Fujitsu on the PRIMERGY RX300 S7* platform based on the Intel® Xeon® processor E5-2690. For additional details, please visit www.spec.org.

5 (Energy Efficient Performance) Source: Performance comparison using best submitted/published 2-socket single-node server results on the SPECpower_ssj*2008 benchmark as of 6 March 2012. Baseline score of 3,329 ssj*_ops/watt published by Hewlett-Packard on the ProLiant DL360 G7* platform based on the prior generation Intel® Xeon® processor X5675. Score of 5,093 ssj*_ops/watt submitted for publication by Fujitsu on the PRIMERGY RX300 S7* platform based on the Intel® Xeon® processor E5-2660. For additional details, please visit www.spec.org.1.

Chip Shot: Intel® Studybook is a Rugged Window to the World

Tue, 10 Apr 2012 11:58:05 -0400

Today, Intel unveiled the Intel studybook – a purpose-built tablet designed to open the doors to education and provide a window on history, math, science, reading and more. Backed up by the Intel Learning Series (Intel® LS) software suite, the rugged tablet is supported by a broad global education ecosystem. To help deliver the best possible educational experience Intel also has added Teacher PC criteria for Ultrabook™ and Notebook systems which will be loaded with Intel LS software to help deliver the best, most innovative environment for learning. Around the world more than 7 million students use the classmate PC for 1:1 eLearning, a milestone announced today. Read the full press release for more information .

From Classrooms to Playgrounds: An Intel® Studybook is a Student's Rugged Window to the World

Mon, 09 Apr 2012 18:46:37 -0400

Intel® Learning Series Expands Product Portfolio

NEWS HIGHLIGHTS

An Intel® studybook, a ruggedized, purpose-built tablet for education, provides mobility for students, comes with Intel® Learning Series (Intel® LS) software suite and is supported by a broad education ecosystem
The Learning Series has added Teacher PC criteria for Ultrabook™ and Notebook systems- enabling a seamless classroom experience
Currently, more than 7 million students worldwide are using Intel classmate PCs

SANTA CLARA, Calif., April 10, 2012 – Intel Corporation today introduced an Intel® studybook, a tablet that is part of the Intel Learning Series family and features unique classroom-ready features and capabilities including an ultra rugged design and specialized educational software. Purpose-built for 1:1 e-learning, a studybook’s innovative features include front and rear cameras, microphone, light sensor support project-based inquiry and mobile learning environments. It comes with a capacitive multi-touch LCD screen and is based on an Intel® Atom™ processor Z650.

The rugged tablet reference design is constructed from a single piece of plastic and includes shock-absorbers around the screen. It is designed to withstand accidental drops from a standard student desk and is also water- and dust- resistant. Young students, often owners of slippery fingers can learn and have fun in and out of the classroom with reduced stress for parents and teachers concerned about damage.

An Intel studybook provides education-focused solutions with a student-friendly design. The education software includes classroom management, LabCam applications that support scientific enquiry, and an optimized e-reader. The collaboration software has a user-friendly interface which enables teachers and students to collaborate in the classroom for improved learning efficiency.

“An Intel studybook offers students limitless opportunities to enhance their learning experience.” said Kapil Wadhera, general manager of Intel’s Education Market Platform Group. “Expanding the Intel Learning Series portfolio of affordable, purpose-built educational devices brings us closer to our vision of enabling more students and teachers to participate in high quality education.”

Teachers are an integral part of the classroom and the new Intel Learning Series Teacher PC criteria will enable solutions that are developed specifically to meet the needs of teachers. The criteria are available to computer manufactures to build purpose built education notebooks and Ultrabooks™ for teachers and will take advantage of the 500 member strong Intel Learning Series ecosystem. Teacher PCs also come with access to education content, professional development and digital literacy resources.

As a component of the Intel Learning Series family of products, an Intel studybook is grounded in ethnographic studies. The hardware and software elements of an Intel studybook have been piloted in more than 2,000 classrooms in 36 countries. Its infrastructure is tailored to individual geographies in terms of content, cultural relevance, and language.

About the Intel Learning Series
Intel® Learning Series brings together digital content, teacher training, deployment support and purpose-built education technology to enable successful 1:1 e-learning environments for students. Through a strong ecosystem of PC manufacturers, operating system vendors, education service providers, content and software providers, the Learning Series delivers complete end-to-end education solutions. More than 500 alliance members in 70 countries are developing applications, peripherals and services optimized for the Learning Series. More information available at www.intellearningseries.com.

Intel, the Intel logo and Ultrabook are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: Intel AppUp℠ center Expands with Urban Airship™

Mon, 09 Apr 2012 18:03:19 -0400

Intel AppUp^{SM center is working with Urban Airship™ to help provide app developers the ability to monetize apps beyond the initial sale to drive ongoing consumer engagement and recurring revenue with Intel AppUp In-App Purchase. Over 40,000 application developers worldwide use Urban Airship’s scalable infrastructure and easy-to-integrate tools to monetize their apps, and now Urban Airship’s developers can reach an expanded base of Ultrabook™ device, netbook, and PC consumers through the Intel AppUp center.}

Chip Shot: Intel Capital is Back in Brazil

Mon, 09 Apr 2012 16:42:49 -0400

Intel Capital has made its first Brazilian investment of 2012 in Minha Vida, the largest health and wellness portal in Brazil which provides Brazilians access to online fitness, diet, beauty, health and wellness programs and medical information. The investment from Intel Capital will enable the company to launch new products and services for users. This is the second healthcare IT related Intel Capital investment in Brazil in less than six months: This past December Intel Capital invested in medical imaging software company Pixeon. Both investments indicate surging healthcare technology innovation and adoption in Brazil, an indication of the market potential for such technologies in the region. Since 1999, Intel Capital has invested approximately $75 million in Brazilian companies. View the full press release.

Chip Shot: Intel 7-Series Chipset Debuts

Mon, 09 Apr 2012 11:00:27 -0400

The new Intel® 7-series Chipset family is now available and shipping in mobile and desktop OEM systems and motherboards worldwide. These new chipsets provide the companion logic to the 2nd Generation Intel® Core™ processors today and will support the 3rd Generation Intel Core processor family (codenamed Ivy Bridge) later in Q2. They also integrate USB 3.0 and enable responsiveness technologies like Intel® Smart Response, Intel® Smart Connect, and Intel® Rapid Start in desktop and mobile platforms. Intel is also introducing several desktop motherboards that feature the new Intel 7-series Express Chipset.

Intel Technology Selected for NISSAN Motor Company's Next-Gen In-Vehicle Infotainment Systems

Thu, 05 Apr 2012 10:24:09 -0400

Companies Collaborate to Bring New Features, User Experiences to the Car

NEWS HIGHLIGHTS

Intel® Atom™ processor will power NISSAN Motor Company's next-generation in-vehicle infotainment system for select production vehicles beginning in 2013.
Intel and NISSAN are engaged in joint research and product development to bring new and innovative driving experiences.
Joint research demonstrates the benefits of integrating consumer electronic device connectivity in the car with cloud-based services.

NEW YORK INTERNATIONAL AUTO SHOW, New York, April 5, 2012 – Intel Corporation announced today that the next-generation in-vehicle infotainment system (IVI) for select NISSAN Motor Company* production vehicles will be powered by the Intel® Atom™ processor beginning in 2013. The IVI system features an innovative twin-display that was unveiled in the Infiniti LE, a luxury zero-emissions concept vehicle, at the New York International Auto Show today. Infiniti is the luxury vehicle brand of the NISSAN Motor Company.

"Technology and vehicles are integral components of everyday life and by combining the two, we can we achieve a truly connected, mobile lifestyle," said Ton Steenman, vice president of Intel's Intelligent Systems Group. "The processing power of the Intel Atom processor enables NISSAN to deliver information and entertainment to drivers and passengers simultaneously in a safe manner and opens the door to more enjoyable driving experiences."

NISSAN selected Intel as a technology partner to jointly develop rich in-vehicle experiences that will keep NISSAN drivers and passengers informed, entertained and productive while maintaining optimal safety. The industry-leading, twin-display will enable the driver to see vital traffic information and navigation while simultaneously delivering entertainment, such as movies, to passengers.

"The Infiniti LE showcases the concept of smart hospitality," said Andy Palmer, executive vice president, NISSAN Motor Company and in charge of Infiniti. "The twin-display, developed with Intel technology inside, is a breakthrough feature that presents driving-related information in the right place and at the right time."

The product development builds on a longstanding relationship between Intel and NISSAN, which includes joint research through Intel Labs to explore new ways to customize applications and enhance mobile device connectivity in the car. Sharing a similar user-centric approach to research and product development, combined with Intel's experience in consumer electronic devices as well as expertise in delivering hardware and software computing solutions and NISSAN's strong understanding of the automotive industry and driving needs, the two companies are helping the automotive industry deliver new driver and passenger experiences.

The joint research focused on several areas of exploration, including mobile device-to-vehicle fusion, cloud-based services for vehicles, and vehicle video surveillance via smartphones, as well as vehicle access and control via smartphones. For example, by using in-car connectivity and cameras and sensors already in the car, the car is able to notify the owner via smartphone when the vehicle is struck in a parking lot. Additionally, using near-field communications or a barcode to securely pair a smartphone with a car enables the smartphone to become a virtual key for remote keyless entry to the vehicle.

The announcement follows additional efforts toward realizing Intel's vision for the connected car including the recent creation of the $100 million Intel Capital Connected Car Fund, the opening of a new global Automotive Innovation and Product Development Center in Karlsruhe, Germany, an academic outreach program focused on IVI and telematics, and the expansion of Intel Labs Experience and Interaction Research in automotive.

Intel, Intel Atom and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: Intel's Ultrabook Campaign Ushers in 'A New Era of Computing'

Wed, 04 Apr 2012 12:24:56 -0400

Intel Corporation’s biggest marketing campaign in nearly a decade kicks off this week with television commercials, online experiences and print ads that the company is hailing as “cinematic and epic.” The multi-faceted global campaign, called “A New Era of Computing,” is aimed at marketing the Ultrabook experience in exciting and innovative ways to consumers. Valued at hundreds of millions of dollars, the campaign is the largest marketing spend for the company since launching Intel® Centrino® in 2003. The initial TV spots are set in the American Old West, ancient China and medieval times that humorously position PCs as old-fashioned and Ultrabooks being, as the campaign theme suggests, “a new era of computing.” “Desperado” debuts on American television on April 6 after a world premiere through paid promotion on Twitter – a U.S. first, according to the online social networking service – two days earlier at twitter.com/intel. That’s today. The spot highlights the responsiveness and quickness of the Ultrabook.

Intel Ushers in 'A New Era of Computing' with Ultrabook Campaign

Wed, 04 Apr 2012 10:30:01 -0400

'Cinematic and Epic' Marketing Campaign is Company's Largest Since 2003

NEWS HIGHLIGHTS

New Ultrabook marketing campaign is Intel's largest in nearly a decade.
Global campaign is aimed at marketing the Ultrabook experience in exciting, innovative ways.
Initial TV commercials are set in the American Old West, ancient China and medieval times.

A spin on the classic spaghetti western, "Desperado" takes place in a saloon where late-19^{th century gunslingers frustrated by the lack of performance of their clunky notebooks feel threatened by this 21st century, Ultrabook-brandishing new kid in town. The spot highlights the responsiveness and quickness of the Ultrabook.}

SANTA CLARA, Calif., April 4, 2012 – Intel Corporation's biggest marketing campaign in nearly a decade kicks off this week with television commercials, online experiences and print ads that the company is hailing as "cinematic and epic."

The multi-faceted global campaign, called "A New Era of Computing," is aimed at marketing the Ultrabook experience in exciting and innovative ways to consumers. Valued at hundreds of millions of dollars, the campaign is the largest marketing spend for the company since launching Intel® Centrino® in 2003.

"῾A New Era of Computing' is going to be very different from what you've seen from Intel in a long time," said Kevin Sellers, vice president, Sales and Marketing Group and director, Advertising and Digital Marketing. "This is not a campaign where we're talking about the microprocessor or Intel the company. Instead, we're giving a cinematic and epic feel to how Intel-inspired Ultrabook systems are ushering in a new era of computing and making everything else seem like ancient history."

Sellers was referring to the initial TV spots set in the American Old West, ancient China and medieval times that humorously position PCs as old-fashioned and Ultrabooks being, as the campaign theme suggests, "a new era of computing." The spots were directed by Daniel Kleinman, a British TV commercial and music video director who also helmed the title sequence for several James Bond movies.

"Desperado" debuts on American television on April 6 after a world premiere through paid promotion on Twitter -- a U.S. first, according to the online social networking service – two days earlier at twitter.com/intel. A spin on the classic spaghetti western, "Desperado" takes place in a saloon where late-19th century gunslingers frustrated by the lack of performance of their clunky notebooks feel threatened by this 21st century, Ultrabook-brandishing new kid in town. The spot highlights the responsiveness and quickness of the Ultrabook.

"House of Flying Laptops," highlighting Ultrabooks' extended battery life and a nod to such stylish martial arts films as "House of Flying Daggers" and "Crouching Tiger, Hidden Dragon," begins in an ancient Chinese temple during the Ming Dynasty. Two traditionally dressed women, each wielding a bulky, power-hungry laptop, engage in an epic battle over a single available power outlet. Their attention quickly turns to a modern woman sitting at a nearby table and working on her Ultrabook.

Set inside a medieval European castle and underscoring Ultrabooks' small form factor and high performance, "Round Table" shows a team of less-than-enthused knights subjected to a slide presentation by their king who is using an outmoded computer that can't keep up. Relief comes to the frustrated monarch when a woman suddenly enters the room with a "mystical device" – an Ultrabook.

Each ad ends with a metaphoric twist as the original ancient setting transforms to a modern-day one. A voiceover at the end says, "Suddenly, everything else seems old-fashioned. Ultrabook. Inspired by Intel."

Venables Bell & Partners in San Francisco created the campaign. The agency was also responsible for Intel's successful and ongoing "Sponsors of Tomorrow" brand campaign that launched in 2009. OMD led global media planning of a campaign that includes TV, print, outdoor, online and other advertisement placements, as well as in-store and online retail campaigns.

While the debuts of the initial three commercials will be staggered through May in the United States and abroad, a unique online experience will allow consumers to interact with the spots starting in mid-April. Visitors to intel.com/ultrabook can create their own adventures through a series of decisions while becoming educated on Ultrabook's product features along the way. Interlude, an Israeli-based technology company delivering unique interactive video experiences, created this campaign element that is scheduled to launch in the United States on April 13 and in 50 countries across 26 languages by the end of April.

"We're expanding the stories of the commercials, making them more personalized, fun and sharable," Sellers said.

"Nothing like this has been done on such an epic scale. We shot scenes for the interactive experience as we were making the commercials in Spain and China to ensure that what you see on TV and online will be beautifully interwoven."

The interactive element also will expose the creative to countries outside where the TV spots will run, a working list that currently includes Australia, Brazil, China, Germany, India, Russia, the United Kingdom and the United States.

Print ads that debut on April 23 in initial markets poke fun at how futuristic the Ultrabook is. One line reads, "Your great-grandkids just called. They want their computer back." Another reads, "So futuristic it'll even feel futuristic in the future." Out-of-home billboards that debut on April 23 also use humor to illustrate the speed and lightweight nature of the Ultrabook with such copy as "Mastodons. Dodos. Bulky laptops." Retail campaigns encompass a range of executions, from merchandising materials and in-store demos to online ads and training for retail salespeople.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: ADFEST 2012 names Intel's Museum of Me 'Best of Social Media'

Fri, 30 Mar 2012 10:42:41 -0500

Intel’s Museum of Me was just named ‘Best in show: cyber category’, ‘Best use of social media’ and ‘Best use of interactive video’ at the prestigious Asia Pacific Advertising Festival, aka ADFEST 2012. This is the latest accolade for the site that social media news hub Mashable labelled “A Must Try” and FWA (Favorite Website Awards) and made its Site of the Day, Month and Year. If you haven't visited the Museum of Me recently, take a look! The exhibition changes as often as you do.

Inaugural Intel Marketing Innovation Awards Announced

Wed, 28 Mar 2012 10:10:45 -0500

SANTA CLARA, Calif., March 28, 2012 – Recognizing standout marketing campaigns within the Intel Inside® and Intel® Brand Advantage programs, Intel Corporation feted a handful of companies with the first Intel Marketing Innovation Awards.

Fujitsu took the Grand Prix for its LIFEBOOK4Life campaign, being the best all-around entry among the various award categories. Fujitsu's campaign sought to increase brand relevance and drive sales for LIFEBOOK notebooks based on the second-generation Intel® Core™ vPro™ processor family. The campaign targeted IT decision-makers in SMB, enterprise and the channel in 40 countries across Europe, the Middle East, Africa and India. The campaign resulted in a 65 percent sales increase by integrating innovative social media activities via LinkedIn, Facebook, word-of-mouth, augmented reality and viral videos with standard advertising.

The Grand Prix recognizes the campaign that best exemplifies the value of innovative approach, stands out from all other entries and sets a new standard for marketing with outstanding results.

Toshiba won the Intel Creative Award that honors the campaign best representing breakthrough design and effective expression of brands and massages. "The Inside Campaign" saw Toshiba and Intel teaming up with Hollywood to deliver a "social film" intended to create brand relevance among young adults. The film delivered more than 50 million video views worldwide.

Presented for the Best Integrated marketing concept with outstanding results, the Intel Integrated Campaign Award went to HP's year-long consumer campaign that featured Japanese pop group AKB48. The campaign included several first-time trials and innovations, and purchase intent rose by 2 million.

The Intel Paid Media Award for best strategy and results from paid media went to Asus' "In Search of Incredible." Asus and Intel set out to raise brand awareness and preference in key markets by launching a global co-marketing campaign with Grammy-winning recording artist Jason Mraz. The campaign was centered on Mraz and media-enthusiast consumers sharing "incredible experiences" online. The campaign reportedly reached more than 2 billion consumers, delivered 5 million unique visitors and elevated key brand metrics among the targeted young adult audience.

Lenovo took the Intel Earned Media Award for efforts in Poland around social media presence development. Using "fun and creative applications" on a social media site as a tool to build relevance and consumer emotional connection for the brands, Lenovo exemplified the award by showing engagement with consumers while supporting strategic objectives and advocating Intel's brands through an original concept. Over 50,000 active users creatively designed superhero cartoon characters that represented Lenovo and Intel, and participated in quizzes and contests that tested their knowledge of various products and technologies. The activity included designing T-shirts with likenesses of their superheroes; the shirts were also available for purchase. As a result, Lenovo and Intel significantly increased fan numbers on Facebook in Poland – 63,000 and 47,000, respectively.

The 2012 awards program was a pilot, and Intel has indicated plans to make this an annual event. Judges for the inaugural year consisted of Intel marketing directors and executives in all geographies.

Intel, Core, vPro and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: Intel's CEO Recognized on Barron's World's Best CEO List

Mon, 26 Mar 2012 14:37:26 -0500

On March 26^{th, Barron's cover story featured its annual list of the world's 30 best CEOs. Barrons' staff selects the 30 leaders, drawing on feedback from investors, analysts and executives. Criteria include stock-price performance, global perspective and entrepreneurial spirit as well as return to customers, employees and investors. According to the weekly financial newspaper, Intel CEO Paul Otellini was named for "stepping boldly into the wireless world", his customer orientation, and making Intel "relevant again -- and less reliant on personal computers."}

Chip Shot: We've Only Just Begun - 26 Ultrabook Designs Available Now

Mon, 26 Mar 2012 11:43:55 -0500

Industry momentum continues to scale in the Ultrabook category with 26 different models now available for purchase in various markets around the world. While the category is a mere 9 months old, manufacturers (OEMs) worldwide are adding more and more devices to their line-ups, such as the Dell XPS, HP Spectre and Toshiba Portege. In addition to the twenty-six on sale already, 10 more systems have been announced by the likes of Fujitsu, Gigabyte, Lenovo and Acer among many others, with more than 75 designs in the pipeline for 2012.

Chip Shot: Conquer Your Taxes with Intel AppUp(SM) center

Mon, 26 Mar 2012 10:34:52 -0500

Tax season is here, so why not tackle your taxes with some help from the Intel AppUp(SM) center? First, make sure you know the big picture of your personal expenses with Expenses at a Glance, which you can utilize to convert units at your leisure with Converter Plus. Then, work through and estimate your home loan and mortgage payments with Home Loan Calc. Finally, to gauge the overall state of the US economy, use Economy to compare state finances, and help ensure you know where your money is going. Your taxes never seemed so manageable!

Chip Shot: Dell Introduces OpenManage Power Center Based on Intel Technology

Fri, 23 Mar 2012 15:04:15 -0500

To help address the growing need for more precise and efficient management of data center power consumption and utilization, Intel and Dell worked together to introduce the advanced version of OpenManage Power Center in the latest generation Dell PowerEdge servers based on Intel® Xeon® processor E5-2600. Dell OpenManage Power Center utilizes real-time power and thermal monitoring and management data available via Intel® Data Center Manager (DCM) and Intel® Node Manager. Read more to find out how accurate data provided by Intel DCM and Dell’s OpenManage Power Center help allow facilities operators and data center managers have more control over power and cooling consumption levels.

Chip Shot: Celebrate National Goof Off Day with Intel AppUp(SM) center

Thu, 22 Mar 2012 10:43:41 -0500

In the spirit of National Goof Off Day, take a break from the daily grind with the Intel AppUp^{SM center}. Harness your inner DJ and mix your own jams with Mixman, now available for free for a limited time (normally $9.99). With Paul Frank Desk, decorate your desktop with quirky, productive desk utilities ranging from a wall calendar to a black-eyed pet fish. Lastly, is there any better way to goof off than with our favorite poultry and pigs, Angry Birds?

Intel Declares Quarterly Cash Dividend

Thu, 22 Mar 2012 07:46:58 -0500

SANTA CLARA, Calif., March. 22, 2012 – Intel Corporation's board of directors has declared a 21 cents per share (84 cents per share on an annual basis) quarterly dividend on the company's common stock. The dividend will be payable on June 1, 2012 to stockholders of record on May. 7, 2012.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: New Media Processor Aimed at Next Gen Set-Top Boxes and Media Gateways

Mon, 19 Mar 2012 18:01:04 -0500

Today Intel announced the Intel® Atom™ CE5300 Media Processor aimed at the next generation of set-top boxes and media gateways. Performance, graphics, power management and user interface improvements in this new product family enables service providers to deploy comprehensive and immersive connected experiences such as the new Amino Freedom Live media gateway which can deliver content seamlessly to TVs, smartphones and tablets around the home. Inside Scoop has more details about this next wave of silicon for platforms supporting the “smart TV experience.”

Chip Shot: Intel Expands Channel Server Portfolio for Intel® Xeon® Processor E5-2600 Product Family

Mon, 19 Mar 2012 14:21:19 -0500

At the Intel Solution Summit (ISS) today, Intel’s Enterprise Platforms and Services Division (EPSD) launched the Intel® Server Continuity Suite software for Intel rack and server products to help channel resellers grow their offerings for small and medium businesses. The software adds to a deep portfolio of hardware, software and solutions offerings that help channel resellers build servers based on the new Intel® Xeon® processor E5-2600 product family. Intel EPSD also announced 50 new channel server solutions, or “recipes,” for the new processor family through its Intel Enabled Solutions Acceleration Alliance (Intel® ESAA).

Chip Shot: Intel Tantalizes Consumers with 'Ultrabook™ Temptations'

Fri, 16 Mar 2012 15:03:37 -0500

What would you do for an Ultrabook™? That’s the question Intel is asking in Ultrabook™ Temptations, a series of six light-hearted social experiments filmed in Australia, Indonesia and Thailand and launched on YouTube today. Would you scour Australia’s iconic Bondi beach for an Ultrabook™ buried in the sand? How about ride an escalator up and down all day in Bangkok or compete to be the most excited person in Indonesia.

Chip Shot: Intel Earns Spot as one of World's Most Ethical Companies

Fri, 16 Mar 2012 11:32:04 -0500

Intel was recognized by the Ethisphere Institute, the leading business ethics think-tank, as one of the 2012 World’s Most Ethical Companies. By implementing and maintaining ethical business practices and initiatives, Intel secured a hard-earned spot on this year’s list. Intel was last recognized on this list in 2009. Learn more about the practices and initiatives that earned Intel this honor.

Chip Shot: Intel Capital Leads Brand Engagement Investments

Thu, 15 Mar 2012 11:00:01 -0500

Intel Capital announced investments in two Bay Area based brand engagement companies BrightEdge and 500friends. BrightEdge is an enterprise platform for both search and social management that enables brands marketers to find customers and secure companies in those channels. 500friends offers a social loyalty solution in which e-commerce retailers utilize tools and analytics to reward customer behaviors. These investments highlight data center innovations that are vital to e-commerce retailers and enterprise users. Since 1991, Intel Capital has invested more than US$10.5 billion in over 1,218 companies in 51 countries. The full BrightEdge release is here and the full 500friends release is here.

Chip Shot: Intel Encourages Engineering Students to STAY WITH IT

Wed, 14 Mar 2012 18:38:08 -0500

Paul Otellini, President and CEO of Intel, Charles Bolden, NASA Administrator and Dr. Gary May, Dean of Engineering of Georgia Tech, discuss the importance of engineering to American innovation in front of hundreds of Georgia Tech students.

Today, the President’s Council on Jobs and Competitiveness in collaboration with engineering schools, Intel, Facebook, MTV and Google officially launched the STAY WITH IT campaign on the campus of Georgia Tech. STAY WITH IT is the first student outreach campaign focused on connecting engineering students to a community of their peers and experienced engineers, role models and influencers to encourage and motivate them to stay with the field of study and graduate with an engineering degree. To learn more, please visit the STAY WITH IT Facebook page.

Teenager Unlocks Potential Pathways for Breast Cancer Treatments, Wins Intel Science Talent Search

Tue, 13 Mar 2012 12:05:12 -0500

Nithin Tumma of Fort Gratiot, Mich. Wins $100,000 Award from the Intel Foundation

NEWS HIGHLIGHTS

Nithin Tumma, whose research could lead to less toxic and more effective breast cancer treatments, received the top award of $100,000 at the Intel Science Talent Search 2012, a program of Society for Science & the Public.
Other finalists from across the U.S. took home additional awards totaling $530,000.
The Intel Science Talent Search, the nation's oldest and most prestigious pre-college science and math competition, recognizes 40 high school seniors who are poised to be the next leaders in innovation and help solve some of the world's greatest challenges.

WASHINGTON, D.C., March 13, 2012 – From medical treatments to alternative energy solutions, innovation has been top of mind in our nation's capital this week. Honoring high school seniors with exceptional promise in math and science, Intel Corporation and Society for Science & the Public (SSP) recognized the winners of the nation's most elite and demanding high school research competition, the Intel Science Talent Search.

Nithin Tumma, 17, of Fort Gratiot, Mich., won the top award of $100,000 from the Intel Foundation for his research, which could lead to more direct, targeted, effective and less toxic breast cancer treatments. He analyzed the molecular mechanisms in cancer cells and found that by inhibiting certain proteins, we may be able to slow the growth of cancer cells and decrease their malignancy. Nithin is first in his class of 332, a varsity tennis player and a volunteer for the Port Huron Museum, where he started a restoration effort for historical and cultural landmarks.

Second place honors and $75,000 went to Andrey Sushko, 17, of Richland, Wash., for his development of a tiny motor, only 7 mm (almost 1/4 inch) in diameter, which uses the surface tension of water to turn its shaft. Born in Russia, Andrey worked from home to create his miniature motor, which could pave the way for other micro-robotic devices. Andrey, a long-time builder of small boats, recently filed for a Guinness World Record for the smallest radio-controlled sailing yacht.

Third place honors and $50,000 went to Mimi Yen, 17, of Brooklyn, N.Y., for her study of evolution and genetics, which focuses on microscopic worms, specifically looking at their sex habits and hermaphrodite tendencies. Mimi believes that through research such as hers, we may better understand the genes that contribute to behavioral variations in humans. Mimi was born in Honduras and is fluent in Cantonese. She plays French horn and volunteers to prepare and deliver meals to people with serious illnesses.

These finalists join the ranks of other notable Science Talent Search alumni who over the past 70 years have gone on to win seven Nobel Prizes, two Fields Medals, four National Medals of Science, 11 MacArthur Foundation Fellowships and even an Academy Award for Best Actress.

"We invest in America's future when we recognize the innovative achievements of our nation's brightest young minds," said Intel President and CEO Paul Otellini. "Hands-on experience with math and science, such as that required of Intel Science Talent Search finalists, encourages young people to think critically, solve problems and understand the world around them. Rather than simply memorizing facts and formulas, or repeating experiments with known outcomes, this competition engages students in an exciting way and provides a deeper level of understanding in such important but challenging subjects."

Other top honors from the competition include:

Fourth Place: Fengning (David) Ding of Albany, Calif. received a $40,000 award for his work on representation theory of Cherednik algebras, a topic in theoretical mathematics that sheds light on deformations of important symmetries, which are related to conservation laws.
Fifth Place: Benjamin van Doren of White Plains, N.Y. received a $30,000 award for investigating a poorly understood behavior of nocturnal migratory birds, called morning flight, which has potential implications for the growing wind power industry.
Sixth Place: Neel Patel of Geneva, Fla. received a $25,000 award for studying how non-speech patterns of sounds – called sonifications – can convey information, which could lead to a computer-user interface as revolutionary as the graphical interface was 30 years ago.
Seventh Place: Anirudh Prabhu of West Lafayette, Ind. received a $25,000 award for his investigation of the odd perfect number problem, and his suggestion that odd perfect numbers do not exist.
Eighth Place: Clara Fannjiang of Davis, Calif. received a $20,000 award for developing enhanced radio telescope data collection methods, which may help astronomers see farther into the universe, and generate clearer images and save processing time.
Ninth Place: Alissa Zhang of Saratoga, Calif. received a $20,000 award for her approaches to monitoring glucose levels in diabetic patients, which may allow for measuring glucose levels in bodily fluids, such as tears, as opposed to blood.
Tenth Place: Jordan Cotler of Northbrook, Ill. received a $20,000 award for inventing a cryptography protocol that permits the detection of eavesdroppers.

In total, the Intel Foundation awarded $1.25 million for the Intel Science Talent Search 2012. When Intel assumed the title sponsorship 14 years ago, it increased the annual awards by more than $1 million to bring greater attention to math and science achievement, encourage more youth to embrace these fields, and further show the impact these subjects have on the country's future success.

This year's finalists hail from 16 states and represent 39 schools. Of the 1,839 high school seniors who entered the Intel Science Talent Search 2012, 300 were announced as semifinalists in January. Of those, 40 were chosen as finalists and invited to Washington, D.C., to compete for the top 10 awards.

Society for Science & the Public, a nonprofit membership organization dedicated to public engagement in scientific research and education, has owned and administered the Science Talent Search since its inception in 1942.

"The Intel Science Talent Search celebrates the accomplishments of our future top researchers and innovators," said Society President Elizabeth Marincola. "Society for Science & the Public is proud to join Intel in congratulating Nithin Tumma and all of the Intel Science Talent Search 2012 finalists. Their dedication to science is inspiring, and the quality and depth of their work bodes well for our nation's continued innovation and economic prosperity."

To learn more about SSP, and its programs and publications, visit www.societyforscience.org, follow SSP on Twitter at www.twitter.com/society4science, or visit SSP's Facebook page at www.facebook.com/societyforscience.

Intel is committed to supporting math and science innovation across all levels of education. The Intel Science Talent Search is just one example of Intel's support of education at the high school level. Tomorrow, at the collegiate level, Otellini will announce STAY WITH IT, a community focused on connecting university engineering students with their peers, experienced engineers, role models and influencers, and motivate them to stay with their specific engineering field of study. The program will launch at Georgia Tech in conjunction with "Day of Engineering." The schedule for this day includes a Facebook Live event at 3 p.m. ET, available at www.facebook.com/engineering; click Tech Talk Live.

To get the latest Intel education news, visit www.intel.com/newsroom/education, and join the conversation on Facebook and Twitter.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Chip Shot: Apps Get Smart with Developer Services Beta

Mon, 12 Mar 2012 11:51:47 -0500

Following the acquisition of Telmap navigation and location-based services, Intel has introduced a new developer services beta providing location-based APIs for enhanced app development capabilities on Ultrabooks and other mobile devices. Developers can use these APIs cross-platform, cross-device and cross-operating systems for functionalities such as geocoding, reverse geocoding, mapping, directions and point of interest to create location-aware games, social networking, lifestyle and other apps for use on any device. Enroll in the developer services beta by signing up today.

Chip Shot: Young Innovators Shine at Intel Science Competition

Mon, 12 Mar 2012 11:23:38 -0500

Kurtis Carsch, 17, of Plano, Tex. discusses with a curious young man his research, which could result in cleaner, lower-cost fuel.

At the Intel Science Talent Search, a program of Society for Science & the Public, Kurtis Carsch, 17, of Plano, Tex. discussed with a curious young man his research which could result in cleaner, lower-cost fuel. Kurtis is one of 40 Intel Science Talent Search finalists competing this week in the nation’s oldest and most prestigious high school science research competition. The top winners in this year’s competition will be announced on Tuesday evening around 9 pm ET. Follow the news here.

Chip Shot: Intel at SXSW 2012

Fri, 09 Mar 2012 13:53:31 -0500

Intel is heading to Austin, TX for SXSW 2012 which kicks off today and runs through Mar. 18. This past week, Intel sponsored a 3-day DJ battle on Turntable.fm, and the winning DJ earned an Ultrabook™ inspired by Intel and will now DJ live at the Turntable.fm event Mar. 10. There will be additional opportunities to win Ultrabook devices with Intel’s “Ultrabook Hunt” on Mar. 15. And to close out SXSW, Intel will sponsor the third annual MOG at The Mohawk music event Mar. 17 which will be streamed live on MOG.com with headline act The Roots. For more information on Intel’s presence at SXSW this year, read “Your Guide to Intel at SXSW 2012.”

Chip Shot: New Intel Server Technology: Powering the Cloud to Handle 15 Billion Connected Devices

Tue, 06 Mar 2012 13:16:51 -0500

Today Intel announced its latest server technology aimed to power the data centers to meet the requirements of ever growing connected world. With more than 3 billion users and 15 billion devices forecasted to be online by 2015, the data centers have to scale to handle 3 times bigger data traffic than today, be more efficient and secure. New, introduced Intel Xeon processors E5-2600 product family are designed to address all key data center challenges with 80% more performance, 50% more performance per watt compared to previous generation. Read here to find all the details about the engine that will power the future of the connected world.

Chip Shot: Intel® Ethernet Controller X540 Brings 10GbE to the Masses

Tue, 06 Mar 2012 13:03:52 -0500

Today, Intel announced the Intel® Ethernet Controller X540, the industry’s first fully integrated 10GBASE-T controller. This space-saving single-chip solution delivers outstanding performance for low-cost, low-power LAN on motherboard (LOM) and Converged Network Adapter (CNA) designs. The Intel Ethernet Controller X540 will help drive broader 10 Gigabit Ethernet (10GbE) adoption by providing connections that are backward-compatible with existing Gigabit Ethernet networks. Like other Intel Ethernet 10 Gigabit products, the Intel Ethernet Controller X540 features advanced I/O virtualization, supports Internet Small Computer System Interface (iSCSI) and Fibre Channel over Ethernet (FCoE), and takes advantage of platform I/O enhancements in the Intel® Xeon® processor E5 family.

New Intel Server Technology: Powering the Cloud to Handle 15 Billion Connected Devices

Tue, 06 Mar 2012 11:49:37 -0500

New Intel® Xeon® Processor E5-2600 Product Family at Heart of a Flexible, Efficient Data Center

NEWS HIGHLIGHTS

New Intel® Xeon® processor E5-2600 product family is built to scale to meet the demands of an increasingly connected world.
New server processors deliver up to 80 percent^{1,2 improved performance compared to the prior generation.}
New Intel® Integrated I/O with PCI Express* 3.0 can up to triple^{3 the movement of data into and out of the processor so information can be made available faster than ever to support data-hungry applications.}
Best data center performance per watt with over 50 percent^{1,4 gain on SPECpower_ssj*2008 plus extends platform power control with Intel® Node Manager and Intel® Data Center Manager.}

SANTA CLARA, Calif., March 6, 2012 – Addressing the incredible growth of data traffic in the cloud, Intel Corporation announced the record-breaking Intel Xeon processor E5-2600 product family. These new processors deliver leadership performance, best data center performance per watt^{1,4, breakthrough I/O innovation and trusted hardware security features to enable IT to scale. These processors are not only at the heart of servers and workstations, but will also power the next generation of storage and communication systems from leading vendors around the world.}

Forecasts call for 15 billion connected devices^{5 and over 3 billion connected users^{6 by 2015. The amount of global data center IP traffic is forecasted to grow by 33 percent annually through 2015, surpassing 4.8 zetabytes per year, more than 3 times the amount in 2011^{6. At these levels, each connected user will generate more than 4GB of data traffic every day – the equivalent of a 4-hour HD movie. This will increase the amount of data that needs to be stored by almost 50 percent per year^{7. In order to scale to meet this growth, the worldwide number of cloud servers is expected to more than triple by 2015^8.}}}}

"The growth in cloud computing and connected devices is transforming the way businesses benefit from IT products and services," said Diane Bryant, Intel vice president and general manager of the Datacenter and Connected Systems Group. "For businesses to capitalize on these innovations, the industry must address unprecedented demand for efficient, secure and high-performing datacenter infrastructure. The Intel Xeon processor E5-2600 product family is designed to address these challenges by offering unparalleled, balanced performance across compute, storage and network, while reducing operating costs."

The key requirements to enable IT to scale are performance, energy efficiency, I/O bandwidth and security. With the best combination of performance, built-in capabilities and cost-effectiveness, the new Intel Xeon processor E5-2600 product families are designed to address these requirements, and become the heart of the next-generation data center powering servers, storage and communication systems.

Leadership Performance with Best Data Center Performance per Watt

Supporting up to eight cores per processor and up to 768GB of system memory, the Intel Xeon processor E5-2600 product family increases performance by up to 80 percent^{1,2 compared to the previous-generation Intel® Xeon® processor 5600 series. The family also supports Intel® Advanced Vector Extension (Intel® AVX) that increases the performance on compute-intensive applications such as financial analysis, media content creation and high performance computing up to 2 times^9.}

Additional built-in technologies such as Intel® Turbo Boost Technology 2.0, Intel Hyper-Threading Technology and Intel® Virtualization Technology provide IT with flexible capabilities to increase the performance of their infrastructure dynamically. These performance advances have led the Intel Xeon processor E5-2600 product family to capture 15^{10 new dual socket x86 world records.}

Modern data centers must improve the raw performance they deliver, but also do so efficiently by reducing power consumption and operating costs. The Intel Xeon processor E5-2600 product family continue Intel's focus on reducing total cost of ownership by improving energy efficient performance more than 50 percent^{1,4 as measured by SPECpower_ssj*2008 compared to the previous generation Intel Xeon processor 5600 series. These processors offer support for tools to monitor and control power usage such as Intel® Node Manager and Intel® Data Center Manager, which provide accurate, real-time power and thermal data to system management consoles. In addition, Intel's leadership performance allows IT managers to meet their growing demands while optimizing software license and capital costs.}

I/O Innovation and Network Capabilities

With the unprecedented growth in data traffic it is essential that systems not only improve computational abilities, but also enable data to flow faster to support data-hungry applications and increase the bandwidth within the data center. The Intel Xeon processor E5-2600 product family meets these needs with Intel® Integrated I/O (Intel® IIO) and Intel® Data Direct I/O (Intel® DDIO). Intel® DDIO allows Intel Ethernet controllers and adapters to route I/O traffic directly to processor cache, reducing trips to system memory reducing power consumption and I/O latency. The Intel Xeon processor E5-2600 product family is also the first server processors to integrate the I/O controller supporting PCI Express* 3.0 directly into the microprocessor. This integration reduces latency up to 30 percent^{11 compared to prior generations and with PCI Express* 3.0 can up to triple^{3 the movement of data into and out of the processor.}}

The high-performance processing power along with Intel® Integrated I/O and advanced storage features such as PCIe* non-transparent bridging and asynchronous DRAM refresh, makes the Intel Xeon processor E5-2600 product family also an ideal choice for storage and communications solutions.

Increasing bandwidth demands driven by server virtualization and data and storage network consolidation have led to strong growth in 10 Gigabit Ethernet deployments, with adapter port shipments exceeding 1 million units in each quarter of 2011^{13. Today's announcement of the Intel® Ethernet Controller X540 demonstrates Intel's commitment to driving 10 Gigabit Ethernet to the mainstream by reducing implementation costs. This industry-first single-chip 10GBASE-T solution is designed for low-cost, low-power LAN on motherboard (LOM) and includes flexible I/O Virtualization and Unified networking support at no additional cost.}

Trusted Security

The Intel Xeon processor E5-2600 product family reaffirms Intel's commitment to providing a more secure hardware foundation for today's data centers. Intel® Advanced Encryption Standard New Instruction (Intel® AES-NI^{14) helps systems to quickly encrypt and decrypt data running over a range of applications and transactions. Intel® Trusted Execution Technology (Intel® TXT^{15) creates a trusted foundation to reduce the infrastructure exposure to malicious attacks. These features in partnership with leading software applications will help IT protect their data centers against attack and scale to meet the demands of their customers.}}

Extensive Industry Support

Starting today, system manufacturers from around the world are expected to announce hundreds of Intel® Xeon® processor E5 family-based platforms. These manufacturers include Acer*, Appro*, Asus*, Bull*, Cisco*, Dell*, Fujitsu*, HP*, Hitachi*, Huawei*, IBM*, Inspur*, Lenovo*, NEC*, Oracle*, Quanta*, SGI*, Sugon*, Supermicro* and Unisys*.

Product, Pricing Details

The Xeon processor E5-2600 product family will be offered with 17 different parts which range in price from $198 to $2,050 in quantities of 1,000. Additionally three single-socket Intel Xeon processor E5-1600 parts will be offered for workstations which range in price from $284 to $1,080. Complete pricing details can be found in the Intel Newsroom. For more details on these new Intel Xeon processors, visit www.intel.com/xeon. For more details on world records and other claims, visit www.intel.com/performance/server/.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

2 (Generational Performance) Source: Performance comparison using best submitted/published 2-socket server results on the SPECfp*_rate_base2006 benchmark as of 6 March 2012. Baseline score of 271 published by Itautec on the Servidor Itautec MX203* and Servidor Itautec MX223* platforms based on the prior generation Intel® Xeon® processor X5690. New score of 492 submitted for publication by Dell on the PowerEdge T620 platform and Fujitsu on the PRIMERGY RX300 S7* platform based on the Intel® Xeon® processor E5-2690. For additional details, please visit www.spec.org. ^16.

3 (I/O Bandwidth) Source: Intel internal measurements of maximum achievable I/O R/W bandwidth (512B transactions, 50% reads, 50% writes) comparing Intel® Xeon® processor E5-2680 based platform with 64 lanes of PCIe* 3.0 (66 GB/s) vs. Intel® Xeon® processor X5670 based platform with 32 lanes of PCIe* 2.0 (18 GB/s). Baseline Configuration: Green City system with two Intel® Xeon® processor X5670 (2.93 GHz, 6C), 24GB memory @ 1333, 4 x8 Intel internal PCIe* 2.0 test cards. New Configuration: Rose City system with two Intel® Xeon processor E5-2680 (2.7GHz, 8C), 64GB memory @1600 MHz, 2 x16 Intel internal PCIe* 3.0 test cards on each node (all traffic sent to local nodes).

4 (Energy Efficient Performance) Source: Performance comparison using best submitted/published 2-socket single-node server results on the SPECpower_ssj*2008 benchmark as of 6 March 2012. Baseline score of 3,329 ssj*_ops/watt published by Hewlett-Packard on the ProLiant DL360 G7* platform based on the prior generation Intel® Xeon® processor X5675. Score of 5,093 ssj*_ops/watt submitted for publication by Fujitsu on the PRIMERGY RX300 S7* platform based on the Intel® Xeon® processor E5-2660. For additional details, please visit www.spec.org.^1,16.

5 (Connect devices) Source: "Worldwide Device Estimates Year 2020 - Intel One Smart Network Work" forecast

6 (datacenter traffic forecast) Source: Cisco® Global Cloud Index: Forecast and Methodology 2010 – 2015. http://www.cisco.com/en/US/solutions/collateral/ns341/ns525/ns537/ns705/ns1175/Cloud_Index_White_Paper.html

7 (Data Storage) Source: "IDC Worldwide Enterprise Storage Systems 2010-2014 Forecast"

8 (Cloud system) Intel internal projections of cloud market growth between 2011 and 2015

9 (AVX) Source: Performance comparison using Linpack benchmark. Baseline score of 159.4 based on Intel internal measurements as of 5 December 2011 using a Supermicro* X8DTN+ system with two Intel® Xeon® processor X5690, Turbo Enabled, EIST Enabled, Hyper-Threading Enabled, 48 GB RAM, Red Hat* Enterprise Linux Server 6.1. New score of 347.7 based on Intel internal measurements as of 5 December 2011 using an Intel® Rose City platform with two Intel® Xeon® processor E5-2690, Turbo Enabled or Disabled, EIST Enabled, Hyper-Threading Enabled, 64 GB RAM, Red Hat* Enterprise Linux Server 6.1. ^16.

10 (World Record Performance) Source: Best available submitted/published performance benchmark results on 2S x86 server platforms as of 6 March 2012. For a full summary of world record performance results, please visit www.intel.com/content/www/us/en/benchmarks/server/xeon-e5-2600-summary.html . For additional details, please visit www.spec.org, www.sap.com/solutions/benchmark, www.vmware.com/a/vmmark, and www.tpc.org.

11 (I/O Latency) Source: Intel internal measurements of average time for an I/O device read to local system memory under idle conditions comparing the Intel® Xeon® processor E5-2600 product family (230 ns) vs. the Intel® Xeon® processor 5500 series (340 ns). Baseline Configuration: Green City system with two Intel® Xeon® processor E5520 (2.26GHz, 4C), 12GB memory @ 1333, C-States Disabled, Turbo Disabled, SMT Disabled. New Configuration: Meridian system with two Intel® Xeon® processor E5-2665 (2.4GHz, 8C), 32GB memory @1600 MHz, C-States Enabled, Turbo Enabled. The measurements were taken with a LeCroy* PCIe* protocol analyzer using Intel internal Rubicon (PCIe* 2.0) and Florin (PCIe* 3.0) test cards running under Windows* 2008 R2 w/SP1.

12 (PCIe* 3.0) Source: 8 GT/s and 128b/130b encoding in PCIe* 3.0 specification enables double the interconnect bandwidth over the PCIe* 2.0 specification (www.pcisig.com/news_room/November_18_2010_Press_Release/ ). Intel internal measurements of maximum achievable I/O R/W bandwidth (512B transactions, 50% reads, 50% writes) using Xeon® processor E5-2680 based platform. Configuration: Rose City system with two Intel® Xeon processor E5-2680 (2.7GHz, 8C), 64GB memory @1600 MHz, 2 x16 Intel internal PCIe* 3.0 test cards on each node (all traffic sent to local nodes).

13 (10GBe) Crehan Research: Server-class Adapter and LOM Market 4Q10

14 (AES-NI) Intel® AES-NI requires a computer system with an AES-NI enabled processor, as well as non-Intel software to execute the instructions in the correct sequence. AES-NI is available on select Intel® processors. For availability, consult your reseller or system manufacturer. For more information, see software.intel.com/en-us/articles/intel-advanced-encryption-standard-instructions-aes-ni/

15 (TXT) No computer system can provide absolute security under all conditions. Intel® Trusted Execution Technology (Intel® TXT) requires a computer with Intel® Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code Modules and an Intel TXT-compatible measured launched environment (MLE). Intel TXT also requires the system to contain a TPM v1.s. For more information, visit www.intel.com/technology/security

16 Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase.

Chip Shot: Intel Introduces Visual Computing Source

Mon, 05 Mar 2012 12:01:13 -0500

Intel® Visual Computing Source launches today as a resource site for game and media application developers. The site provides free downloads of application developer tools and the latest information on Intel’s visual computing tools including Intel® Graphics Performance Analyzers, Intel® Media Software Development Kit (SDK) and Intel® OpenCL SDK. Intel Visual Computing Source also provides technical papers, case studies, videos, product briefs and sample code. Keep tabs on updates to Intel Visual Computing Source on Twitter @VC_Developer or Facebook.

Intel Takes Gaming Graphics to Next Level with Developer Tools

Mon, 05 Mar 2012 10:58:05 -0500

Expands Support to Smartphones, Tablets and Ultrabook™ Devices

NEWS HIGHLIGHTS

Intel releases Intel® GPA 2012, the latest suite of tools for game and media app developers to optimize performance.
Intel® GPA 2012 now available for smartphone, tablet and Ultrabook™ app developers.
Support for Google Android*-based devices to be publically available this year.

GAME DEVELOPERS CONFERENCE, San Francisco, March 5, 2012 – Intel Corporation today introduced Intel® Graphics Performance Analyzers (Intel® GPA) 2012, the latest version of a powerful tool suite to optimize performance of gaming, media and entertainment applications. Expanding upon Intel's mobile momentum, Intel® GPA 2012 will support mobile applications for Ultrabook™ devices and Android*-based smartphones and tablets for the first time.

Previously available only on PC platforms, Intel GPA helps developers improve the experience of game and media applications by accessing powerful tools to analyze and optimize performance on Intel® Core™ and Intel® Atom™ processor-based platforms. The tool suite enables developers to enhance application performance on smartphones, tablets, Ultrabooks and PCs. Developers can also optimize Web content for browsers that support hardware-accelerated rich media, including Microsoft Internet Explorer* 9, Google Chrome* and Mozilla Firefox*.

"Gaming is one of the largest consumer segments for smartphones, but nobody wants a game that drains a smartphone battery," said Craig Hurst, Intel's director of Visual Computing Product Management. "There are few choices for developers who want to optimize apps for power, so Intel GPA 2012 introduces power metrics, ensuring that a game not only has great performance, but also runs longer on Ultrabooks, Android tablets and smartphones."

The Intel GPA tool suite includes:

Intel® GPA System Analyzer – Analyzes game performance and identifies potential bottlenecks that slow down performance or affect graphics. This tool allows developers to perform optimization experiments to fine-tune performance without changing application code. New in Intel GPA 2012, Intel GPA System Analyzer now supports a standalone mode that enables real-time analysis of application performance on smartphones, tablets and Ultrabooks, including Android devices. Intel GPA System Analyzer can be used to analyze an application's power usage and how it will affect battery life on mobile devices.
Intel® GPA Frame Analyzer – Offers application developers deep frame analysis of individual application elements such as shaders, textures and pixel history. Intel GPA Frame Analyzer shows the visual and performance impact of each individual element in real time without affecting the application source code.
Intel® GPA Platform Analyzer – Developers can visualize performance of application tasks and the effect on devices by viewing CPU metrics and graphics workloads. PC application developers can also see how their software would perform in a multi-core environment. Intel GPA Platform Analyzer has been rebuilt from the ground up for the release of Intel GPA 2012 to provide more system behavior information. Additionally, the tool is capable of handling large volumes of data to emulate application performance on an extended run.
Intel® GPA Media Analyzer – When used in conjunction with Intel® Media SDK, Media Analyzer enables developers to see how effectively an application uses hardware-accelerated video encode and decode in real-time.

Intel GPA 2012 is available as a free download at www.intel.com/software/gpa. Support for Android devices is expected to be publically released this year.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3 and SSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality or effectiveness of any optimization on microprocessors not manufactured by Intel.

Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.

Chip Shot: Intel Recognized for Reducing Greenhouse Gases

Thu, 01 Mar 2012 15:14:00 -0500

Yesterday Intel received a Climate Leadership Award, recognizing the company as an industry leader in driving innovative solutions to reduce greenhouse gas emissions. The Climate Leadership Awards were given for the first time this year, through a partnership between the U.S. EPA, the Association of Climate Change Officers, the Center for Climate and Energy Solutions, and The Climate Registry. Learn more about the actions Intel has taken to reduce greenhouse gases and why it won this prestigious award.

Chip Shot: Intel and DENSO Collaborate on Automotive Research

Thu, 01 Mar 2012 11:01:20 -0500

Intel is collaborating with DENSO Corporation for joint research into next-generation in-vehicle information and communication systems. The goal of the collaboration is to develop a platform for in-vehicle information and communications systems that can seamlessly connect and share information with mobile devices and to safely provide drivers with information about their vehicles. The joint research will combine Intel’s expertise in developing technologies for personal computing and DENSO’s knowledge of in-vehicle IT products and advanced infotainment functions.

Chip Shot: Intel Invests in Connected Car Research and Product Development

Wed, 29 Feb 2012 14:01:12 -0500

Intel announced several initiatives and investments to spur product development and research for new connected car experiences. The investments include the new global Automotive Innovation and Product Development Center, the expansion of Intel Labs Interaction and Experience Research (IXR), an academic outreach program for automotive projects, and the newly-established $100 million Intel Capital Connected Car Investment Fund. Located in Karlsruhe, Germany, the Automotive Innovation and Product Development Center aims to accelerate innovations for in-vehicle infotainment and telematics solutions based on Intel technology. And with the expansion of Intel Labs IXR, Intel will gain valuable insights into the relationships between humans, cars and technology.

Intel Capital to Invest in Future of Automotive Technology

Wed, 29 Feb 2012 11:27:23 -0500

NEWS HIGHLIGHTS

Intel Capital creates a $100 million Intel Capital Connected Car Fund to accelerate technology innovation in the automotive industry.
Intel Capital Connected Car Fund targeted at technologies that will deliver new in-vehicle infotainment solutions, seamless mobile connectivity, compelling applications and advanced driver assistance systems.
By 2014, automobiles will be among the top three fastest-growing market segments for connected devices and Internet content.

SANTA CLARA, Calif. and KARLSRUHE/FELDKIRCHEN, Germany, Feb. 29, 2012 – Intel Capital today announced a $100 million investment fund to help accelerate innovation and the adoption of new technology and services in the automotive industry. Intel Capital is the first global technology investment organization headquartered in Silicon Valley to announce a dedicated focus on automotive technology innovation.

The Intel Capital Connected Car Fund will be invested globally over the next 4 to 5 years in hardware, software and services companies developing technologies to promote new, compelling in-vehicle applications and enable the seamless connection between vehicles and any connected device, including mobile devices and sensors.

"Technology has become an integral component of everyday life, with consumers demanding uninterrupted access to the Internet and the constant flow of information, news, entertainment, and social media," said Arvind Sodhani, president of Intel Capital and Intel executive vice president. "Automobiles must be able to provide these same consistent and engaging computing experiences, but in a safe manner. The Intel Capital Connected Car Fund will drive the development of technologies to enhance the in-vehicle experience of the future."

The announcement is part of Intel's ongoing work with automakers and in-vehicle infotainment suppliers to help integrate advanced technologies into cars. Ultimately, the connected car will have the intelligence and context awareness to offer the right information, at the right time and in the right way to keep drivers and passengers informed, entertained and productive while maintaining optimal safety. Once the car becomes connected, it can also communicate with the cloud, the transportation infrastructure and even other vehicles to provide additional services such as advanced driver assistance and real-time traffic information to optimize the flow of traffic.

"The car is the ultimate mobile device," said Staci Palmer, general manager of Intel's Automotive Solutions Division. "By 2014, automobiles will be among the top three fastest-growing areas for connected devices and Internet content.¹ Intel's experience in developing personal computing, software, security and cloud computing technologies will bring a new level of innovation to the car to enhance the driving experience for both drivers and passengers."

To help realize that vision, areas of investment for the Intel Capital Connected Car Fund will include technologies that advance the next generation of in-vehicle infotainment, advanced driver assistance systems and seamless mobile connectivity. This includes new in-vehicle applications and development tools, next-generation ADAS technologies and multimodal capabilities such as speech recognition, gesture recognition and eye tracking optimized for the connected car.

In addition to the Intel Capital Connected Car Fund, Intel Corporation President and CEO Paul Otellini also announced today at an event in Karlsruhe, Germany the opening of a new global Automotive Innovation and Product Development Center, an academic outreach program focused on IVI and telematics, and expansion of Intel Labs Experience and Interaction Research in automotive.

About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

About Intel Capital
Intel Capital, Intel's global investment and M&A organization, makes equity investments in innovative technology start-ups and companies worldwide. Intel Capital invests in a broad range of companies offering hardware, software, and services targeting enterprise, mobility, health, consumer Internet, digital media, semiconductor manufacturing and cleantech. Since 1991, Intel Capital has invested more than US$10.5 billion in over 1,218 companies in 51 countries. In that timeframe, 196 portfolio companies have gone public on various exchanges around the world and 291 were acquired or participated in a merger. In 2011, Intel Capital invested US$526 million in 158 investments with approximately 51 percent of funds invested outside the U.S. and Canada. For more information on Intel Capital and its differentiated advantages, visit www.intelcapital.com.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

1 Gartner: Automobile of the Future: The Ultimate Connected Mobile Device (ID: G00175335)

Intel Invests in Product Development and Research to Spur Innovation in the Connected Car

Wed, 29 Feb 2012 11:26:47 -0500

Company Opens New Product Development Center, Expands Intel Labs Experience and Interaction Research

NEWS HIGHLIGHTS

Global Automotive Innovation and Product Development Center will accelerate innovations and product development for in-vehicle infotainment and telematics solutions based on Intel technology.
Intel invests in academic outreach program to foster innovative ideas, research and technology among academia, Intel and the automotive industry.
Company expands Intel Labs Interaction and Experience Research in automotive to further explore relationships among human behavior, cars and technology.
Intel Capital is the first global technology investment organization to announce $100 million Connected Car Fund focused on investing in automotive technology innovation.

SANTA CLARA, Calif., and KARLSRUHE, Germany, Feb. 29, 2012 – Intel Corporation today announced several automotive investments and initiatives designed to spur innovation and product development that will enable new and innovative connected car experiences. The investments include the new Automotive Innovation and Product Development Center, expansion of Intel Labs Interaction and Experience Research (IXR) in automotive, an academic outreach program, and the establishment of the $100 million Intel Capital Connected Car Investment Fund.

"In today's mobile world, personal computing touches every part of consumers' daily lives while at home, at the office and on the road," said Intel President and CEO Paul Otellini. "By broadening our research efforts, academic and capital investments and opening the Automotive Innovation and Product Development Center, Intel is deepening its understanding of how people interact with their cars and how Intel innovations can enhance the automotive experience."

The Automotive Innovation and Product Development Center will serve as Intel's global center of competence for the development of products and technologies for in-vehicle infotainment and telematics solutions for the connected car. The center will optimize Intel technologies for applications and services as well as capabilities for consumer electronics integration, performance optimization and system design.

Located in Karlsruhe, Germany, the site benefits from its proximity to top technical universities and a robust ecosystem of hardware and software vendors with expertise in automotive technology. The customized facility features a unique secured car park that provides an on-site location for Intel to install, test and showcase developments. Additional features include state-of-the-art instrumentation, a myriad of antennae to provide satellite, TV, digital video and GPS for development and testing, and a world-class engineering compute infrastructure.

Intel also announced plans for a comprehensive academic program that includes fundamental and applied research, curriculum development and internship programs to foster the exchange of innovative ideas among academia, Intel and the automotive industry. The program will be hosted at the Karlsruhe site and will tap into an extensive Intel European Research and Development network of researchers and developers, labs and research relationships.

Expanding Research to Explore Human Interactions in Vehicles

With the expansion of Intel Labs Interaction and Experience Research, Intel and its customers will obtain valuable insights into consumer experiences in the vehicle. Intel aims to apply that knowledge to the development of technology solutions for the vehicle and transportation infrastructure to make the driving experience more enjoyable, intuitive and safe. For example, Intel is looking at new ways to use the Internet, sensors and context-aware technology to determine what and how information should be presented to drivers and passengers to reduce complex interactions while driving.

Intel Capital Creates $100 Million Connected Car Fund

Today, Intel Capital became the first global technology investment organization to announce an investment fund focused on fostering automotive technology innovation. The Intel Capital Connected Car Fund aims to accelerate the seamless connection between the vehicle and consumer electronic devices as well as drive new in-vehicle applications, services and differentiated user experiences based on Intel technologies. Over the next 5 years, Intel Capital will invest in hardware, software and services companies that are developing leading-edge ingredient technology and platform capabilities that support Intel's focus areas in automotive.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Intel, Micron Update NAND Flash Memory Joint Venture

Mon, 27 Feb 2012 19:36:04 -0500

Companies Expand Successful NAND Flash Memory Joint Development Program to Include Development of Emerging Memory Technologies

SANTA CLARA, Calif. and BOISE, Idaho, Feb. 28, 2012 – Intel Corporation and Micron Technology, Inc., today announced that the companies have entered into agreements to expand their NAND Flash memory joint venture relationship.

The agreements, which are designed to improve the flexibility and efficiency of the joint venture, include a NAND Flash supply agreement for Micron to supply NAND products to Intel and agreements for certain joint venture assets to be sold to Micron. Under terms of the agreement, Intel is selling its stake in two wafer factories in exchange for approximately $600 million—the approximate book value of Intel's share. Additionally, Intel will be receiving approximately half of the consideration in cash and the remaining amount will be deposited with Micron, which may be refunded or applied to Intel's future purchases under the NAND Flash supply agreement. The agreements also extend the companies' successful NAND Flash joint development program and expand it to include emerging memory technologies.

"Micron's joint venture NAND development efforts with Intel are a model of innovation, productivity and effectiveness," said Micron Chief Executive Officer Mark Durcan. "With IM Flash and its associated programs, our companies have become leaders in the NAND Flash arena. These new agreements build on that success."

"The Intel-Micron partnership has created industry-leading NAND Flash memory technology and developed a robust global manufacturing network. The new NAND Flash supply agreement with Micron gives Intel better flexibility to meet growing demand for SSDs and other products," said Robert Crooke, Corporate Vice President and General Manager of the Non-Volatile Memory Solutions Group, Intel.

As part of these agreements, Micron will increase its share of the overall NAND Flash output and optimize its global manufacturing network by purchasing the assets of IM Flash Singapore (IMFS) and the IM Flash Technologies (IMFT) assets in Manassas, Va.

Micron has also agreed to supply Intel with NAND Flash memory from its facilities. The IMFT joint venture NAND manufacturing facility in Lehi, Utah, will continue to operate with minimal changes to its existing operations. The facility is currently in production on the companies' industry-leading 20nm NAND Flash memory technology. The transaction is expected to close during the first half of this year, subject to certain conditions.

About Micron Technology, Inc.
Micron Technology, Inc., is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets a full range of DRAM, NAND and NOR flash memory, as well as other innovative memory technologies, packaging solutions and semiconductor systems for use in leading-edge computing, consumer, networking, embedded and mobile products. Micron’s common stock is traded on the NASDAQ under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.

*Micron and the Micron logo are trademarks of Micron Technology, Inc. Intel is a trademark of Intel Corporation or its subsidiaries in the United States and other countries. All other trademarks are the property of their respective owners.

*This press release contains forward-looking statements related to the timing of the closing of the transaction between Micron and Intel (the "Companies") related to updating their NAND Flash joint venture relationship. Actual events or results may differ materially from those contained in the forward-looking statements. Please refer to the documents the Companies file from time to time with the Securities and Exchange Commission, specifically each of their most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for each of the Companies to differ materially from those contained in our forward-looking statements. Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements.

Chip Shot: Intel Announces Intel® Cloud SSO Beta Backed by Salesforce.com

Mon, 27 Feb 2012 13:57:44 -0500

Today Intel announced a beta version of Intel® Cloud SSO, an identity and access management-as-a-service (IAMaaS) offering available on Force.com. With Intel Cloud SSO, enterprise users gain single sign-on access to all Salesforce.com applications and dozens of other SaaS apps, through a secure, personalized portal. Strong two-factor mobile authentication, user account provisioning and de-provisioning, enterprise-class identity lifecycle management features, and integration with McAfee Cloud Security Platform provide end-to-end protection for cloud-based apps. The beta is available to a limited number of customers, with general availability scheduled for Q2. To be considered for the beta, visit here.

Visa and Intel Form Strategic Alliance to Advance Mobile Commerce

Mon, 27 Feb 2012 11:21:52 -0500

Multi-device, Multi-year Agreement to Develop Mobile Commerce Solutions for Smartphones and Tablets; Intel Smartphone Reference Device Certified for Use with Visa payWave

Barcelona, Spain, February 27, 2012 — Visa Inc. (NYSE:V) and Intel Corporation today announced a strategic agreement to develop mobile commerce solutions tailored to consumers in developed and developing countries. During a press conference at Mobile World Congress in Barcelona, the companies outlined plans to collaborate to ensure consumers enjoy a consistent, streamlined, secure mobile commerce experience across Intel® Atom™-based smartphones and tablets.

"Visa's agreement with Intel paves the way for financial institutions around the globe to offer their account holders mobile payments and financial services using innovative mobile devices and technologies designed by Intel," said John Partridge, President, Visa Inc. during the press conference. "This is another example of how Visa is making mobile payments broadly available across devices and operating systems and is ensuring that mobile commerce applications are aligned with existing technology and security standards established by the global payments industry."

The initial phase of the agreement between Visa and Intel includes:

Visa has certified Intel's Smartphone Reference Device powered by the Intel® Atom™ processor Z2460 for use with Visa payWave, Visa's mobile payment technology that enables consumers to make fast and secure payments at retail locations by simply waving their mobile phone in front of a payment terminal. This will enable turn-key implementation for OEMs delivering NFC-enabled smartphones.
The Intel Smartphone Reference Device will host the Visa payWave payment application and features NFC (Near Field Communication) technology, the short range communications standard that enables mobile phones to securely transmit payment information to a payment terminal.
When used in combination with a Visa-compliant UICC, smartphones based on the Intel Smartphone Reference Device handset can be enabled to connect to Visa Inc.'s mobile provisioning service providing financial institutions and mobile operators the means to securely download Visa payment account information and the Visa payWave application "over the air" to a secure chip on an NFC-equipped smartphone. The connection to Visa's mobile provisioning service can be enabled by a Trusted Services Management platform, such as Giesecke & Devrient's (G&D) platform.

"Intel's strategy is to enable more secure and compelling user experiences across a range of Intel-based mobile devices. Our alliance with Visa builds on this strategy and brings worldwide mobile payment and commerce solutions to Intel-based devices," said Mike Bell, Intel Vice President and General Manager of the company's Mobile and Communications Group. "Our work with Visa also extends to our customers designing products based on Intel's Smartphone Reference Device."

The agreement combines Visa's expertise in payment processing, account holder authentication and global network reach, with Intel's expertise and leadership in developing innovative technologies that serve as the foundation for the world's computing devices.

At Mobile World Congress in Barcelona, from February 27th to March 1st, the companies will showcase Visa mobile services on the new Intel mobile device, including V.me by Visa, Visa's new digital wallet service featuring the Visa payWave application; Movida, Visa's new payment service in India; and Visa Mobile Prepaid, Visa's new mobile-based product tailored to consumers in developing countries. Product demonstrations will be on display at Visa's booth in Hall 1, stand 1B19, and Intel's booth in Hall 8, stand B192.

About Visa Inc.
Visa is a global payments technology company that connects consumers, businesses, financial institutions and governments in more than 200 countries and territories to fast, secure and reliable digital currency. Underpinning digital currency is one of the world’s most advanced processing networks—VisaNet—that is capable of handling more than 20,000 transaction messages a second, with fraud protection for consumers and guaranteed payment for merchants. Visa is not a bank, and does not issue cards, extend credit or set rates and fees for consumers. Visa’s innovations, however, enable its financial institution customers to offer consumers more choices: Pay now with debit, ahead of time with prepaid or later with credit products. For more information, visit www.corporate.visa.com.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

Lava First to Deliver New Smartphone Based on Intel Technology to Fast-Growing India Market

Mon, 27 Feb 2012 11:21:42 -0500

Lava Launches XOLO Brand, Bringing Best of Intel Computing to Mobile Users in India

MOBILE WORLD CONGRESS, Barcelona, Spainand New Delhi, India, Feb. 27, 2012 - Intel Corporation and Lava International Ltd., one of India's fastest-growing mobile handset companies, announced that the companies are collaborating to launch the XOLO X900 -- India's first smartphone with Intel Inside®. The XOLO X900 from Lava is based on Intel's smartphone reference design featuring the Intel® Atom™ processor Z2460 with Intel® Hyper-Threading Technology and supporting HSPA+ with the Intel XMM 6260 Platform.

Lava is a successful and growing mobile phone brand in the Indian market. In order to bring a high- performance and differentiated smartphones to the market, Lava has collaborated with Intel to introduce its first Intel-based smartphone under the brand XOLO. The XOLO X900 Android smartphone is expected to hit retail shelves in India early in the second quarter this year and will support all major 2G and 3G networks.

"We are proud to partner with Intel on XOLO to bring a superior smartphone computing experience to customers in India," said Vishal Sehgal, co-founder and director, Lava International. "Over the last two and a half years, we have built our business in the feature phone segment where Lava has been the brand of choice for nearly 10 million Indian customers. With XOLO, we intend to now serve the discerning and fast-paced smartphone customer, which is where this collaboration with Intel is critical to us."

"India is one of the fastest-growing smartphone markets with the world's second-largest mobile subscriber base," said Mike Bell, Intel vice president and general manager of the Mobile and Communications Group. "We are pleased to be working with Lava to bring the best of Intel computing to the India market. Lava's XOLO X900 device is a great result of our collaboration. It also demonstrates how innovative and compelling products can be brought to market through strong partnerships by using Intel's smartphone reference design as a foundation."

The XOLO X900 is powered by a super-fast 1.6 Ghz processor and comes equipped with a 4.03-inch high-resolution LCD touch screen for crisp text and vibrant images. The smartphone delivers a fast application, Web browsing and multitasking experience, and also features two cameras for advanced imaging and video capabilities, including burst mode that allows individuals to capture 10 pictures in under a second with 8-megapixel quality. The smartphone also supports HDMI®, NFC and HD video playback.

As service providers roll out 3G services and connect more cities in India, the smartphone market will grow as more people access the Internet from their phones. The smartphone opportunity in India for 2012 stands at 19.1 million units which is a 78 percent growth year-on-year over 2011, according to Deepak Kumar, research director for Telecommunications and Mobile Phones, IDC India.

Lava XOLO X900 Smartphone with Intel Inside®

About Lava
Lava international is one of the fastest growing brands in Indian mobile market today. The organization started operations only 30 months back and is rapidly growing its market share. “Get the power in your hand”- with this motto as the guiding principle, Lava embarked on its journey to empower people with innovative products. Today the brand has a wide range of handsets in its portfolio. The company has already expanded its operations in all the states of India and has a network of 1,000 distributors and presence in ~50,000 retail counters.

Intel, Atom and the Intel logo are trademarks of Intel Corporation in the United States and other countries. Lava, Xolo and Lava Xolo are trademarks of Lava International Ltd.

* Other names and brands may be claimed as the property of others.

Intel Expands Smartphone Portfolio: New Customers, Products, Software and Services

Mon, 27 Feb 2012 11:21:29 -0500

Announces Smartphone Device Engagements with Orange*, Lava*, ZTE* and Visa*

Discloses Range of New Smartphone SoCs and Communications Products

MOBILE WORLD CONGRESS, Barcelona, Spain, Feb. 27, 2012 – Intel Corporation President and CEO Paul Otellini today detailed a number of announcements and plans aimed at expanding the company's smartphone product portfolio and customer ecosystem, including strategic new engagements with Orange*, Lava International Ltd.*, ZTE*, and Visa*.

"We are very pleased to add new, important customers and capabilities to our phone offerings today. We remain focused on delivering exciting new features and outstanding performance to smartphone customers around the world." said Otellini.

Otellini made the announcements during an Intel news conference at Mobile World Congress. He also highlighted the company's plans to expand its smartphone SoC and communications product roadmaps for the performance and value smartphone market segments.

New Smartphone Customer Engagements

Building on strategic engagements with Motorola Mobility Inc.* and Lenovo*, Intel detailed new device relationships with Orange, Lava International Ltd. and ZTE.

Yves Maitre, Orange senior vice president of Mobile Multimedia and Devices, joined Otellini to discuss a new Orange smartphone based on the Intel® Atom™ processor Z2460 reference design. Housed in a sleek body, the design enables rich entertainment experiences and Orange services, including Orange TV, Daily Motion, Deezer, Orange Wednesdays and Orange Gestures. The Orange smartphone will be available in the United Kingdom and France later this summer.

Intel also announced plans to enter the high-growth market for smartphones in India through an alliance with Lava International Ltd., one of the fastest-growing Indian mobile handset companies.Vishal Sehgal, Lava co-founder and board director, announced the launch of XOLO Smartphone by Lava. The XOLO X900 is based on Intel's smartphone reference design and will be the first Intel technology-based smartphone in the India market. The device will be available from top retail outlets early in the second quarter of 2012 and will support major Indian cellular networks.

Similar to its previously announced partnership with Motorola Mobility, Intel also announced a multi-year mobile device collaboration across smartphones and tablets with global handset maker ZTE. Mr. He Shiyou, executive vice president and head of the Terminal Division of ZTE, discussed how his company's alliance with Intel will enable ZTE to move faster and create unique and differentiated products for wireless operators. He also announced that ZTE's first Intel-powered mobile device is scheduled to debut in the second half of 2012.

Expanding Smartphone SoC and Communications Roadmaps

Building on its ecosystem engagements, Intel announced plans for three new smartphone SoC products that expand the company's portfolio from the performance-to-value market segments.

Extending the leading performance and energy efficiency of the Intel™ Atom® processor Z2460, formerly codenamed "Medfield," Intel announced that the platform will now support speeds up to 2GHz.

Intel also announced the Atom™ Z2580 processor that doubles the performance of the Atom processor Z2460, and features an advanced multimode LTE/3G/2G solution. Intel will sample the Z2580 in the second half of the year with customer products scheduled in the first half of 2013.

Addressing the growing handset opportunity in emerging markets where consumers look for more value at lower prices, Intel disclosed plans for the Intel® Atom™ processor Z2000.

The Z2000 is aimed squarely at the value smartphone market segment, which industry sources predict could reach up to 500 million units by 20151.The platform includes a 1.0 GHz Atom CPU offering great graphics and video performance, and the ability to access the Web and play Google Android* games. It also supports the Intel® XMM 6265 3G HSPA+ modem with Dual-SIM 2G/3G, offering flexibility on data/voice calling plans to save on costs. Intel will sample the Z2000 in mid-2012 with customer products scheduled by early 2013.

Building on these 32nm announcements, Otellini discussed how the Atom™ processor will outpace Moore's Law and announced that Intel will ship 22nm SoCs for carrier certification next year, and is already in development on 14nm SoC technology.

In 2011, Intel shipped in more than 400 million cellular platforms. Building on this market segment position, Intel announced the XMM 7160, an advanced multimode LTE/3G/2G platform with support for 100Mbps downlink and 50Mbps uplink, and support for HSPA+ 42Mbps. Intel will sample the product in the second quarter with customer designs scheduled to launch by the end of 2012.

Intel also announced that it is sampling the XMM 6360 platform, a new slim modem 3G HSPA+ solution supporting 42Mbps downlink and 11.5Mbps uplink for small form factors.

Building Better Experiences on Intel Architecture

Intel's strategy is to create and enable engaging, consistent, aware and secure user experiences across a range of mobile devices.

An emerging trend is the use of mobile devices to enable secure online and retail commerce. Otellini welcomed John Partridge, President, Visa Inc., who announced a strategic multi-year alliance to develop mobile commerce solutions tailored to consumers in developed and developing countries.

The effort includes collaboration across a range of Visa mobile services and Intel® Atom™-based smartphones and tablets to deliver compelling and secure user services. As a first step, Partridge announced that Intel's smartphone reference design is now certified for Visa payWave* mobile financial transactions. This means that customer products based on Intel's smartphone reference design will have time-to-market support of Visa mobile services.

Building on its collaboration with Google, Intel continues to work closely with ISVs to help ensure the majority of Android apps run on Intel Atom processor-based devices. Otellini discussed how Intel has all the right tools and expertise to support the robust mobile application developer ecosystem.

Intel, Atom and the Intel logo are trademarks of Intel Corporation in the United States and other countries. * Other names and brands may be claimed as the property of others.

* Other names and brands may be claimed as the property of others.

1 Strategy Analytics

Chip Shot: Craig Barrett an Engineering Hero

Thu, 23 Feb 2012 17:16:37 -0500

Former Intel Chairman and CEO, Craig Barrett, was recognized today as one of eight Stanford Engineering Heroes, an honor bestowed upon Stanford University faculty and alumni engineers who have advanced the course of human, social, and economic progress through engineering. Now in its second year, the primary objective of this honor is to herald the profession and the profound effect engineering has on our everyday lives.

Chip Shot: Intel Unveils First Videos in 60 Second Insights Campaign

Thu, 23 Feb 2012 17:13:50 -0500

Intel is launching an online video conversation platform called 60 Second Insights, created to bring together leaders in their respective areas to share their visions and perspectives on technology and mobility - how our culture, business, art to our youth, family and health are impacted and how technology and mobility will evolve going forward. 60 Second Insights is out to capture the enthusiasm that we all share on mobility and technology and also create a platform for an ongoing conversation on where we go from here. The first of these videos featuring executives from companies such as Ericsson, DreamWorks, Pandora and TechShop and innovators including a National Geographic explorer and fashion designer are now LIVE for viewing.

Chip Shot: Intel Capital Invests in Brazilian E-Commerce

Fri, 17 Feb 2012 11:45:16 -0500

Brazilian fashion e-commerce websites Coquelux and Fashion.me have received investments from Intel Capital. Coquelux is an online shopping club that provides exclusive access to flash events where members can purchase discounted premium and luxury labels. Fashion.me is a social platform in which members create customized looks from more than two million labels and share them in the Fashion.me social network. The two investments build out critical components of the e-commerce ecosystem in Brazil, offering opportunities to create online experiences tailored specifically to interests, needs and cultural preferences. As one of the first technology venture capital organizations in Brazil, Intel Capital long ago recognized the need to stimulate the local creation of compelling online experiences to keep pace with Brazil's rapid technology adoption. Since 1999, Intel Capital has invested approximately $75 million across the region. Full press release here.

Chip Shot: Spotlight Shines on Ultrabook with its "Pop-Up Theater" Debut in Los Angeles

Thu, 16 Feb 2012 11:42:56 -0500

Intel is taking its Ultrabook™ message to the streets, literally, using 60 synchronized and choreographed Ultrabook devices to create a "Pop-Up Theater" via a flash mob in and around Los Angeles landmarks. See the larger than life human mobile billboard.

Chip Shot: Happy 100th Arizona: Intel Microprocessor One of State's Great Innovations

Tue, 14 Feb 2012 12:52:35 -0500

Today, Arizona celebrates 100 years of statehood. Noting important people, places and events that shaped the state, the Intel Pentium microprocessor is highlighted as one of the state's Top 10 innovations. Intel first arrived in Arizona in 1979 and its factories in Chandler played a part in the production of the Intel Pentium Chips. Now under construction in Chandler is soon to be the world’s most advanced high-volume semiconductor factory - Fab 42 – which will produce Intel Core processors on 14nm technology.

Intel's Next-Generation Communications Platform Key to Accelerated Network Services

Tue, 14 Feb 2012 10:20:45 -0500

Forthcoming Platform to Boost Secure Network Performance, Scale with Needs of the Future

NEWS HIGHLIGHTS

New communications platform will consolidate packet, application and control processing on Intel® architecture for more efficient processing of multimedia content without sacrificing security.
Scalable platform to enable faster time to market and lower development costs for equipment manufacturers with better network efficiency for service providers. New platform will further expand Intel's offerings for the network infrastructure.

SANTA CLARA, Calif., Feb. 14, 2012 - Intel Corporation today disclosed several significant features for the company's next-generation communications platform, codenamed "Crystal Forest."Building upon Intel's strong presence in communications infrastructure, the platform will handle data processing across the network more efficiently and securely, while addressing the specialized needs for handling cloud connectivity and content processing.

Each minute of the day, 30 hours of video are uploaded across the network, and by 2015 it is estimated to take 5 years to watch all the video crossing IP networks each second.^{1 As these numbers continue to climb, the burden will be on equipment manufacturers and service providers to deliver platform solutions that can cost-effectively manage rapidly increasing traffic without compromising performance and security.}

Currently, equipment manufacturers must combine a variety of highly specialized silicon co-processors with different software programming models to handle multiple communications workloads when building platforms for a scalable network - a very complex and expensive endeavor. With Crystal Forest, equipment manufacturers will be able to consolidate three communications workloads - application, control and packet processing - on multi-core Intel architecture processors to deliver better performance and accelerate time to market. They can also develop a scalable product line based on multiple Intel processor options to plan for future performance increases.

"The demand for increased network performance will continue to grow as more smart devices connect to the Internet every day," said Rose Schooler, general manager of Intel's Communications Infrastructure Division. "And with the popularity of social networking and other high-bandwidth services, such as video and photo uploads/downloads, interactive video, crowdcasting and online gaming, service providers will be challenged to efficiently provision sufficient upstream capacity and manage the spike in network traffic."

Intel's next-generation communications platform, Crystal Forest, is expected to deliver up to 160 million packets per second performance for Layer 3 packet forwarding, making it possible to send thousands of high-definition videos across each network node. Previously, only ASIC or specialized processors were capable of sending more than 100 million packets per second. The Intel® Data Plane Development Kit, a set of software libraries and algorithms, improves the performance and throughput of packets on Intel architecture platforms to yield more than five times the performance over previous generations of Intel platforms.

Crystal Forest will also utilize Intel® QuickAssist technology, which processes and accelerates specialized packet workloads - cryptography, compression and deep packet inspection included - on standard Intel platforms. Using this technology, secure Internet transactions can be accelerated up to 100Gbps on the platform to give service providers the ability to handle many more secure transactions and without the cost of specialized solutions. The network will also be able to evolve to provide "always-on" secure Internet connections, as opposed to the opt-in connections currently used on select applications or for financial transactions online.

Designed to Grow with the Network

The Crystal Forest platform will enable equipment manufacturers to design more flexible platforms, from small- to medium-sized business firewalls to high-end routers. Service providers, too, can save money by deploying fewer complex platforms, making their network easier to manage and maintain. The Intel platform roadmap plans to deliver annual performance refreshes for several years, so equipment manufacturers and service providers will be able to scale and refresh their designs to meet future network needs. Additionally, Crystal Forest will use a common application programming interface and common drivers so that multiple designs can be implemented in much less time and at much lower development costs.

Full System Simulation of the Crystal Forest Platform

Developers can accelerate software development, testing and integration by utilizing a simulation model of the Crystal Forest platform provided by Wind River Simics*. With Simics, users can model any Crystal Forest target configuration and then run unmodified target software on that model. Wind River Simics enables developers to do BIOS bring-up, operating-system optimization and application development more efficiently.

The new platform is scheduled to be available later in 2012. For more information visit the Intel newsroom media kit.

Intel is a trademark of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.

1 Cisco® Visual Networking Index: Forecast and Methodology, 2010-2015

Chip Shot: Staying in Shape with Social Wellness

Mon, 13 Feb 2012 16:34:03 -0500

Tune in for MashUp Radio this Friday, Feb. 17th at 12:00 p.m. PT for tips on how to ward off those extra winter pounds and stay fit ahead of swimsuit season. Peter Biddle will be chatting with Robin Thurston, co-founder of MapMyFitness, about different ways to track, measure and expand your fitness opportunities with help from social communities and fitness websites.

Chip Shot: Exclusive willpower360 App Launches Only on Intel AppUp(SM) Center

Mon, 13 Feb 2012 11:00:53 -0500

Available exclusively on the Intel AppUp^{SM center}, a one-stop shop for apps optimized for Ultrabooks and PCs, will.i.am’s willpower360 app enables users to enjoy a 360-degree music and video experience with updates throughout 2012. Users can change the music, video view they experience, listen to new tracks created by noted rapper and producer will.i.am on his Ultrabook and see how he performed those songs in concert.

New York Attorney General Agrees to Terminate Antitrust Lawsuit Against Intel

Thu, 09 Feb 2012 16:12:03 -0500

SANTA CLARA, Calif. Feb. 9, 2012 – Intel Corporation and the New York Attorney General have agreed to terminate the lawsuit alleging violation of U.S. and state antitrust laws that was filed by the New York Attorney General in November 2009.

The agreement, which follows a December 2011 court ruling that greatly reduced the scope of the New York Attorney General’s lawsuit, expressly states that Intel does not admit either any violation of law or that the allegations in the complaint are true, and it calls for no changes to the way Intel does business. The agreement includes a payment of $6.5 million from Intel that is intended only to cover some of the costs incurred by the New York Attorney General in the litigation.

“Following recent court rulings in Intel’s favor that significantly and appropriately narrowed the scope of this case, we were able to reach an agreement with New York to bring to an end what remained of the case. We have always said that Intel’s business practices are lawful, pro-competitive and beneficial to consumers, and we are pleased this matter has been resolved,” said Doug Melamed, senior vice president and general counsel at Intel.

A copy of the agreement is available at www.intel.com/pressroom/legal/nyag.htm.

Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.

* Other names and brands may be claimed as the property of others.